NXP releas New 20 V Trench MOSFETs in DFN1006

NXP PMZ600UNE PMZ950UPE PMZB600UNE PMZB950UPE

NXP has just released four new 20 V N- and P-channel MOSFETs in DFN1006. The PMZ600UNE, PMZ950UPE, PMZB600UNE, and PMZB950UPE feature TrenchMOS technology, ESD protection greater than 1 KV HBM, and a drain-source-on-state resistance down to 470 mOhm. They are optimized for space constrained applications such as switching-circuits, load switches and relay drivers in smart phones and tablets.

NXP PMZ600UNE

All three types are housed in ultra small leadless DFN1006 packages with a footprint of only 1.0 × 0.6 mm and package heights down to 0.37 mm. These single transistor types follow on from the previously released dual types in DFN1010: PMDXB600UNE, PMDXB950UPE, and PMCXB900UE.

Our complete portfolio of single and dual versions of 20 V Trench MOSFETs are available in different DFN packages, offering design flexibility and the perfect solution for every portable and wearable device. 

Features and Benefits

  • Trench MOSFET technology
  • Leadless ultra small DFN plastic packages 1.0 × 0.6 mm
  • Electro static discharge (ESD) protection > 1 kV HBM
  • Drain-source on-state resistance RDSon = 470 mOhm and 1.02 Ohm
  • Very low threshold voltage for portable applications VGs(th) = 0.7 V

Key Applications

  • Relay driver
  • High speed line driver
  • Low-side load switch
  • Switching circuit

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