NXP just released our first medium-power Schottky rectifier PMEG45T15EPD with Trench technology in CFP15 (SOT1289) FlatPower package. Due to the Trench process, the new type offers a very low reverse current of only 30 µA. The voltage drop value remains about the same compared to planar types. Furthermore, it delivers a reverse voltage of 45 V and a average forward current of 15 A.
The rectifier is housed in an ultra-thin CFP15 package, with a package height of only 0.78 mm, integrated clip-bond technology and a large heat sink. It is capable of temperatures up to 150 °C. This makes it highly suitable for applications such as high-efficiency low-power adapter, especially at high operating temperatures.
The new Trench type expands the earlier released planar portfolio of medium-power Schottky rectifiers in CFP15. The expansion of our porfolio will continue with the release of our first automotive qualified Trench type in September.
Key features and benefits
- Average forward current: IF(AV) ≤ 15 A
- Reverse voltage: VR ≤ 45 V
- Low forward voltage, VF typ = 480 mV (@ 15 A)
- Low leakage current, IR typ = 30 µA (@ 45 V) due to Trench MEGA Schottky technology
- High-power capability due to clip-bonding technology and heat sink
- Small and thin SMD power plastic package, typical height 0.78 mm
Key applications
- High-efficiency DC-to-DC conversion
- Switch mode power supply
- Reverse polarity protection
- Low power consumption application
