The 8-channel ADG3308 guarantees up to 40-Mbps data transfer between circuits with different logic levels over a 1.2-V to 5.5-V supply range, while reducing design work and component count.
Analog Devices is launching the first in a new series of digital switches that allow a single IC to provide bi-directional data transfer and voltage translation. Its 8 channels, by allowing a mix of simultaneous read and write functions with bi-directional data transfer, provide designers greater flexibility and efficiency over traditional bus switches that require separate read/write cycles. The ADG3308's advanced circuit integration also reduces design work and saves board space, making it an ideal solution for portable consumer applications such as cell phones and notebook computers.
The ADG3308 guarantees direct data transfer between devices operating from supplies as different as 1.2-V and 5.5-V. This large voltage translation range allows analog or digital devices having widely differing logic levels to communicate seamlessly in the smallest possible board area without losing data. Designers can use a mix of high- and low voltage circuitry in an application without requiring complex translation solutions that involve many discrete components. For example, a 1.5-V ASIC can easily communicate with a 3.3-V DAC (digital-to-analog converter) when the ADG3308 is placed between the devices in the signal chain.
Unlike current solutions, the ADG3308 does not require a DIR pin to select the data direction—it is automatically sensed by each individual channel in the device, allowing simultaneous read and write signals for more efficient data communication. Available in smaller LFCSP (lead frame chip scale packaging) options, the ADG3308 has tri-state switching on both input and output which provides greater design flexibility.
Applications
The ADG3308 is well-suited for applications involving data transfer between a low-voltage DSP/Controller and a higher-voltage device—including portable communication devices such as cell phones, PDAs and notebook computers. Other applications include high-end consumer electronics such as: game consoles—where constant changes to the chipset designs result in multiple supply levels in the application; network computer and telecommunications infrastructure; ATE; instrumentation; and automotive.
Pricing and Availability
The ADG3308 is available in 20-lead TSSOP (thin shrink small outline package) and 4mm x 4mm LFCSP (lead frame chip scale package) packages. Pricing per unit in 1,000-piece quantities is $1.60. Samples are available now, with full production scheduled for July 2004.
