Micron to Showcase Mobile Portfolio, Including New NAND Flash and Mobile DDR DRAM MCP.
Micron Technology announced its new line of multichip package (MCP) memory for use in feature-rich mobile phones. Driven by the need for increased speed, extended functionality, and reduced package size, feature-rich 2.5G and 3G handset designs require flexible, high-capacity memory subsystems. By combining Micron’s NAND flash memory with its Mobile DRAM featuring Endur-IC™ technology in the same package, designers now have a convenient option to include quality Micron memory direct from the company into their high-performance handset designs.Micron’s NAND and Mobile DRAM MCP devices are currently sampling to select customers and are expected to be available in 1Gb NAND/512Mb Mobile DDR DRAM configurations for production in Q4 2006.
