Extended temperature memory products address data storage demands of increasingly complex applications including infotainment and ADAS
Toshiba Memory Europe GmbH has begun sample shipments of embedded NAND flash memory products for automotive applications that are compliant with JEDEC UFS[1] version 2.1[2]. The new products meet AEC-Q100 Grade 2[3] requirements, support the wide temperature range of -40 °C to +105 °C, and offer the enhanced reliability capabilities that are required by increasingly complex automotive applications.
The new embedded NAND flash memory products integrate NAND chips fabricated with 15 nm process technology and a controller in a single package. Five different capacities of 16 GB, 32 GB, 64 GB, 128 GB and 256 GB[4] support a variety of automotive applications. These include infotainment, which typically needs high-capacity storage, and wireless communications, which may need only a small capacity.
Storage requirements for automotive applications continue to increase as systems including automotive information and entertainment systems and ADAS[5] become more sophisticated. UFS supports their high performance and density needs. The addition of automotive UFS expands Toshiba Memory Europe’s line-up of embedded NAND flash memory products for automotive applications, which currently includes automotive e-MMC[6] products. Utilising the UFS interface allows the new products to achieve sequential read of 850 MB/s and random read of 50kIOPs, which are approximately 2.7 times and 7.1 times faster than their current e-MMC counterparts, respectively.[7]
Other new functions specifically suited to automotive applications have been added to the new UFS products, including Refresh, Thermal Control and Extended Diagnosis. Refresh can be used to refresh data stored in the UFS and can contribute to the extension of the data’s life span. Thermal Control protects against overheating in the high temperatures that can occur in automotive applications. Extended Diagnosis helps users to understand the condition of the product.
Toshiba Memory’s UFS products have been used to boost overall system performance in mobile devices, and the introduction of automotive UFS products is expected to have a similarly positive impact on the development of automotive information and entertainment systems and ADAS. Toshiba Memory Corporation is already in discussion with major automobile makers on the possibility of implementing the new line-up in next-generation projects. As the storage requirements for automotive applications continue to grow, Toshiba Memory Corporation will continue to lead the market by reinforcing its line-up of high-performance, high-density memory solutions targeting the sector.
Outline of the New Products
| Interface | JEDEC UFS V2.1 standard HS-G3 interface |
| Capacity | 16 GB, 32 GB, 64 GB, 128 GB, 256 GB |
| Power Supply Voltage | 2.7-3.6 V (Memory core) 1.7 V-1.95 V (Interface) |
| Temperature Range | -40 °C to +105 °C |
| Product Name | Capacity | Package | Sample Date | |
| THGAF9G7L1LBAB7 | 16 GB | 153 Ball FBGA | 11.5×13.0×1.0mm | Dec. 2017 |
| THGAF9G8L2LBAB7 | 32 GB | 153 Ball FBGA | 11.5×13.0×1.0mm | Dec. 2017 |
| THGAF9G9L4LBAB8 | 64 GB | 153 Ball FBGA | 11.5×13.0×1.2mm | Dec. 2017 |
| THGAF9T0L8LBAB8 | 128 GB | 153 Ball FBGA | 11.5×13.0×1.2mm | Dec. 2017 |
| THGAF9T1LBLBABY | 256 GB | 169 Ball FBGA | 12.0×16.0×1.6mm | 2Q, 2018 (Apr. - Jun.) |
*Company names, product names, and service names mentioned herein may be trademarks of their respective companies.
Notes
[1] Universal Flash Storage (UFS) is the product category for the class of embedded memory products built to the JEDEC UFS standard specification.
[2] One of the standard specifications of embedded NAND flash memory defined by JEDEC.
[3] Electrical component qualification requirements defined by the AEC (Automotive Electronics Council).
[4] Product density is identified based on the density of memory chip(s) within the product, not the amount of memory capacity available for data storage by the end user. Consumer-usable capacity will be less due to overhead data areas, formatting, bad blocks, and other constraints, and may also vary with the host device and application – 1GB is calculated as 1,073,741,828 bytes. For details, please refer to applicable product specifications.
[5] Advanced Driver Assistance System
[6] e-MMC is a product category for a class of embedded memory products built to the JEDEC e-MMC Standard specification.
[7] Comparison of Toshiba Memory Corporation’s 64GB devices.
