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NewsTechnology of Electronic Components

News & Press Releases Technology of Electronic Components - 2

Subsection: "Technology of Electronic Components"
Search results: 62 Output: 11-20
  1. Toshiba Shows 128Gb NAND Flash Using 19nm Process Technology
    Technology of Electronic Components Computers & Peripherals Toshiba
    Toshiba exhibited a 300mm wafer that had 128-Gbit NAND flash memory chips and was made by using 19nm process technology at nano tech 2013. The company employed the 19nm process technology, which is the industry's most advanced process used for ...
    21-02-2013
  2. Toshiba Ships Samples of Industry's First Universal Flash Storage Devices
    Technology of Electronic Components Office Equipment Toshiba THGLF0G9B8JBAIE
    JEDEC UFS Ver.1.1 standard compliant embedded memories combine up to 64GB NAND and controller in single package Toshiba Corporation and Toshiba Electronics Europe have announced shipping of samples of its 64-gigabyte (GB) embedded NAND flash memory ...
    19-02-2013
  1. China makes its own 22-nm transistor
    Technology of Electronic Components
    The Institute of Microelectronics of the Chinese Academy of Sciences (IMECAS) has announced it has made a high-K metal-gate MOSFET with a gate length of 22 nanometers. The home-designed and built device shows world-class performance and low power ...
    25-12-2012
  2. Moving Forward on Energy Efficiency: Fujitsu Semiconductor Aims to Start Production of GaN Power Devices
    Supply Technology of Electronic Components Power Fujitsu
    Achieves high output power of 2.5kW in power supply units for servers Fujitsu Semiconductor announced that it successfully achieved high output power of 2.5kW in server power supply units equipped with gallium-nitride (GaN) power devices built on a ...
    18-11-2012
  3. Carbon nanotube pencil leads used for drawing sensors onto paper
    Sensors Technology of Electronic Components Future Technologies Measurement
    MIT has developed pencil 'leads' that can be used to draw gas sensors onto paper We’ve already seen a pen with silver-based ink, that lets its user draw electrical circuits on ordinary paper. Now, scientists from MIT have brought similar ...
    15-10-2012
  4. 'Nanocable' could be big boon for energy storage
    Technology of Electronic Components
    Rice University’s coaxial nanocable outperforms previous microcapacitors Thanks to a little serendipity, researchers at Rice University have created a tiny coaxial cable that is about a thousand times smaller than a human hair and has higher ...
    21-06-2012
  5. Cheaper sodium batteries could replace lithium-ion tech
    Technology of Electronic Components Future Technologies Supply
    New tech could lead to cheaper, more capacious batteries New research shows that sodium rechargeable batteries could replace lithium-ion batteries in electronics and some electric vehicles. This would require using a new electrode material that ...
    11-05-2012
  6. NEC goes ultra-thin with 0.3mm-thick batteries
    Supply Technology of Electronic Components NEC
    NEC , which has been working on what is called organic radical battery (ORB) technology for some years, has announced its latest ORB breakthrough, the 0.3mm thick ORB. The output rated as 5kW/L with a capacity of 3mAh. On full charge, the new ...
    24-03-2012
  7. Researchers develop graphene supercapacitor for portable electronics
    Capacitors Technology of Electronic Components Power
    Electrochemical capacitors (ECs), also known as supercapacitors or ultracapacitors, differ from regular capacitors that you would find in your TV or computer in that they store sustantially higher amounts of charges. They have garnered attention as ...
    20-03-2012
  8. Biodegradable Transistors - Made from Us
    Technology of Electronic Components Future Technologies
    Award-winning TAU research uses blood, milk, and mucus proteins to build next generation technology Silicon, a semi-conducting element, is the basis of most modern technology, including cellular phones and computers. But according to Tel Aviv ...
    16-03-2012
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