News & Press Releases Technology of Electronic Components - 4

Infineon Technologies has produced the first chips on a 300-millimeter thin wafer for power semiconductors at the Villach site in Austria. This makes Infineon the first company in the world to succeed in taking this step forward. The chips now ...

(Reuters) - Chipmakers Intel Corp, Toshiba Corp and Samsung Electronics Co Ltd will join hands to develop technologies that could more than halve semiconductor line widths to nearly 10 nanometers by 2016, the Nikkei daily reported. Samsung ...

Sirenza Microdevices announced that the company has produced what it believes to be the first Gallium Nitride (GaN) power amplifier with an output power above 2 Watts and a noise figure (NF) below 1 db, encompassing the 0.2 to 8 GHz range. Details ...

Nanosys says it has found a material that can double the capacity of flash memory found in conventional chips by adding self-assembled metal nanocrystals to the flash manufacturing process. Nanosys, which has shown that the tiny particles of metal ...

Intel Corporation announced that its future processors, beginning with its entire family of 45 nm high-k metal gate (Hi-k) processors, are going 100 % lead-free. The Intel 45 nm Hi-k family includes the next-generation Intel® Core™ 2 Duo, ...

IBM announced that researchers at its Almaden Research Center have demonstrated magnetic resonance imaging (MRI) techniques to visualize nanoscale objects. This technique brings MRI capability to the nanoscale level for the first time and ...

IBM today announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore's Law beyond its expected limits. The technology called through-silicon vias -- ...

Brighter LEDs and better solar cells could be developed using the least reflective coating ever made. Researchers found that depositing an array of angled silicon-dioxide nanorods on a surface dramatically reduces its refractive index a measure of ...

Experimental Chips Could Bring TeraFLOP Performance, Terabytes of Bandwidth into Wide Use in Future Computers and Data Centers In a speech at the Intel Developer Forum, Intel Senior Fellow and Chief Technology Officer Justin Rattner said that ...

The future could be filled with T-shirts that light up or beach umbrellas that collect solar energy to run portable televisions, if new organic semiconductor technology comes into play. Cornell University researchers have developed a new type of ...