Datasheet Texas Instruments TMS320C6424ZDU4
Manufacturer | Texas Instruments |
Series | TMS320C6424 |
Part Number | TMS320C6424ZDU4 |
Fixed-Point Digital Signal Processor 376-BGA 0 to 90
Datasheets
TMS320C6424 Fixed-Point Digital Signal Processor datasheet
PDF, 1.6 Mb, Revision: D, File published: Jan 11, 2010
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Prices
Status
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes |
Packaging
Pin | 376 | 376 | 376 | 376 |
Package Type | ZDU | ZDU | ZDU | ZDU |
Industry STD Term | BGA | BGA | BGA | BGA |
JEDEC Code | S-PBGA-N | S-PBGA-N | S-PBGA-N | S-PBGA-N |
Package QTY | 60 | 60 | 60 | 60 |
Carrier | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) | JEDEC TRAY (5+1) |
Device Marking | L2 | TMS320 | 4 | C6424ZDU |
Width (mm) | 23 | 23 | 23 | 23 |
Length (mm) | 23 | 23 | 23 | 23 |
Thickness (mm) | 1.78 | 1.78 | 1.78 | 1.78 |
Pitch (mm) | 1 | 1 | 1 | 1 |
Max Height (mm) | 2.48 | 2.48 | 2.48 | 2.48 |
Mechanical Data | Download | Download | Download | Download |
Parametrics
DSP | 1 C64x+ |
Rating | Catalog |
Eco Plan
RoHS | Compliant |
Design Kits & Evaluation Modules
- JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
XDS560v2 System Trace USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU200-U
XDS200 USB Debug Probe
Lifecycle Status: Active (Recommended for new designs) - JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
XDS560v2 System Trace USB & Ethernet Debug Probe
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Implementing DDR2 PCB Layout on the TMS320C6424 DSPPDF, 147 Kb, File published: Oct 16, 2008
This application report contains implementation instructions for the DDR2 interface contained on the TMS320C6424 digital signal processor (DSP) device. The approach to specifying interface timing for the DDR2 interface is quite different than on previous devices.The previous approach specified device timing in terms of data sheet specifications and simulation models. The system designer was r - TMS320C642x Power Consumption Summary (Rev. D)PDF, 141 Kb, Revision: D, File published: Feb 17, 2012
- TMS320C642x Pin Multiplexing UtilityPDF, 1.3 Mb, File published: Jul 9, 2007
The C642x devices use a great deal of internal pin multiplexing to allow the most functionality in the smallest and lowest cost package. The software accompanying this application report allows the pin multiplexing registers of the device to be calculated with ease, as well as showing what peripherals can be used together and what devices of the C642x family support the peripherals that are select - Using the TMS320C642x Bootloader (Rev. B)PDF, 256 Kb, Revision: B, File published: Mar 23, 2012
This document describes the functionality of the C642x ROM bootloader software. Please note that the ROM bootloader requires use of Application Image Script (AIS) as the primary data format for loading code/data. AIS is a Texas Instruments, Inc. proprietary data format. AIS is explained in detail in Section 2 of this document. - Using DMA with Framework Components for C64x+ (Rev. A)PDF, 859 Kb, Revision: A, File published: Oct 29, 2007
This application note describes the standard DMA software abstractions and interfaces for TMS320 DSP Algorithm Standard (xDAIS) compliant algorithms designed for the C64x+ EDMA3 controller using DMA Framework Components utilities. The DMA Framework Component utilities described in this document include a standard DMA resource specification and negotiation protocol (IDMA3), a DMA Resource Manager ( - 5Vin C642x Power using a PMIC (Multi-output DC/DC Converter)PDF, 302 Kb, File published: Oct 9, 2008
- TMS320C620x/C642x McBSP: UART (Rev. C)PDF, 293 Kb, Revision: C, File published: Sep 9, 2008
This document describes how to use the multichannel buffered serial port (McBSP) in the Texas Instruments (TI) TMS320C6000в„ў (C6000в„ў) digital signal processors (DSP) to interface to a universal asynchronous receiver/transmitter (UART). Descriptions of the hardware configuration and software routines necessary for proper functionality are included.The McBSP is not capable of support - 5Vin C642x Power using DC/DC Controllers and LDOPDF, 741 Kb, File published: Oct 9, 2008
- 5Vin C642x Power using Integrated-FET DC/DC Converters and LDOPDF, 550 Kb, File published: Oct 9, 2008
- 12Vin C642x Power using Integrated-FET DC/DC Converters and LDOPDF, 310 Kb, File published: Oct 9, 2008
- EDMA v2.0 to EDMA v3.0 (EDMA3) Migration Guide (Rev. A)PDF, 292 Kb, Revision: A, File published: Aug 21, 2008
This application report summarizes the key differences between the enhanced direct memory access (EDMA3) used on C64x+в„ў DSP devices and the EDMA2 used on TMS320C64xв„ў DSP devices, and provides guidance for migrating from EDMA2 to EDMA3. - TMS320C64x to TMS320C64x+ CPU Migration Guide (Rev. A)PDF, 310 Kb, Revision: A, File published: Oct 20, 2005
This document describes migration from the Texas Instruments TMS320C64xв„ў digital signal processor (DSP) to the TMS320C64x+в„ў DSP. The objective of this document is to indicate differences between the two cores and to briefly describe new features. Functionality in the devices that is identical is not included. For detailed information about either device, see the TMS320C64x/C64x+ DSP - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revision: B, File published: Aug 13, 2015
- Understanding TI's PCB Routing Rule-Based DDR Timing Specification (Rev. A)PDF, 93 Kb, Revision: A, File published: Jul 17, 2008
This application report motivates the way the DDR high-speed timing requirements are now going to be communicated to system designers. The traditional method of using data sheet parameters and simulation models is tedious. The system designer uses this information to evaluate whether timing specifications are met and can be expected to operate reliably.Ultimately, the real question the hardwa - Thermal Considerations for the DM64xx, DM64x, and C6000 DevicesPDF, 127 Kb, File published: May 20, 2007
As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000в„ў DSP devices. - Introduction to TMS320C6000 DSP OptimizationPDF, 535 Kb, File published: Oct 6, 2011
The TMS320C6000™ Digital Signal Processors (DSPs) have many architectural advantages that make them ideal for computation-intensive real-time applications. However to fully leverage the architectural features that C6000™ processors offer code optimization may be required. First this document reviews five key concepts in understanding the C6000 DSP architecture and optimization. Then
Model Line
Series: TMS320C6424 (33)
- TMS320C6424ZDU4 TMS320C6424ZDU5 TMS320C6424ZDU6 TMS320C6424ZDU7 TMS320C6424ZWT4 TMS320C6424ZWT5 TMS320C6424ZWT6 TMS320C6424ZWT7 TMS320C6424ZWTL TMX320C6424AZWT TMX320C6424CZDU TNETV2664ACLZWT TNETV2664FIBZWT TNETV2664FIDZWT TNETV2665FIBZWT4 TNETV2665FIBZWT6 TNETV2665FIBZWT7 TNETV2665FIDZWT4 TNETV2665FIDZWT6 TNETV2665FIDZWT7 TNETV2665VIDZWT4 TNETV2665VIDZWT6 TNETV2665VIDZWT7 TNETV2665ZWT4 TNETV2665ZWT6 TNETV2665ZWT7 TNETV2666ACLZWT TNETV2666FIBZWT TNETV2666FIDZWT TNETV2666INZWT TNETV2667FIBZWT TNETV2667FIDZWT TNETV2667ZWT
Manufacturer's Classification
- Semiconductors > Processors > Digital Signal Processors > C6000 DSP > Other C6000 DSP