Datasheet Texas Instruments 5962-9752701Q3A
| Manufacturer | Texas Instruments |
| Series | SN54CBTD3384 |
| Part Number | 5962-9752701Q3A |
10-Bit Bus Switches With Level Shifting 28-LCCC -55 to 125
Datasheets
SN54CBTD3384, SN74CBTD3384 datasheet
PDF, 998 Kb, Revision: R, File published: Jan 15, 2004
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 28 | 28 | 28 | 28 |
| Package Type | FK | FK | FK | FK |
| Industry STD Term | LCCC | LCCC | LCCC | LCCC |
| JEDEC Code | S-CQCC-N | S-CQCC-N | S-CQCC-N | S-CQCC-N |
| Package QTY | 1 | 1 | 1 | 1 |
| Carrier | TUBE | TUBE | TUBE | TUBE |
| Device Marking | 5962- | 3384FK | SNJ54CBTD | 9752701Q3A |
| Width (mm) | 11.43 | 11.43 | 11.43 | 11.43 |
| Length (mm) | 11.43 | 11.43 | 11.43 | 11.43 |
| Thickness (mm) | 1.83 | 1.83 | 1.83 | 1.83 |
| Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 |
| Max Height (mm) | 2.03 | 2.03 | 2.03 | 2.03 |
| Mechanical Data | Download | Download | Download | Download |
Parametrics
| Number of Channels | 10 |
| Operating Temperature Range | -55 to 125 C |
| Package Group | LCCC |
| Package Size: mm2:W x L | 28LCCC: 131 mm2: 11.43 x 11.43(LCCC) PKG |
| Rating | Military |
| Ron(Max) | 7 Ohms |
| Ron(Typ) | 5 Ohms |
| Technology Family | CBT |
| VCC(Max) | 5.5 V |
| VCC(Min) | 4.5 V |
Eco Plan
| RoHS | See ti.com |
Application Notes
- How to Select Little Logic (Rev. A)PDF, 1.1 Mb, Revision: A, File published: Jul 26, 2016
TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b - Understanding Advanced Bus-Interface Products Design GuidePDF, 253 Kb, File published: May 1, 1996
- Flexible Voltage-Level Translation With CBT Family DevicesPDF, 40 Kb, File published: Jul 20, 1999
Voltage translation between buses with incompatible logic levels can be accomplished using Texas Instruments (TI) translation-voltage clamps (TVC) or standard crossbar technology (CBT) devices. CBT devices in this application offer flexibility in designs, protection of circuits that are sensitive to high-state voltage-level overshoots, and cost efficiency. - Selecting the Right Texas Instruments Signal SwitchPDF, 769 Kb, File published: Sep 7, 2001
Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi - Migration From 3.3-V To 2.5-V Power Supplies For Logic DevicesPDF, 115 Kb, File published: Dec 1, 1997
This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, File published: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - 5-V To 3.3-V Translation With the SN74CBTD3384 (Rev. B)PDF, 35 Kb, Revision: B, File published: Mar 1, 1997
The emergence of low-voltage technology required existing 5-V systems to interact with 3.3-V systems. Compatibility issues of mixed-mode operation created the need for 5-V to 3.3-V translation. Buffers and transceivers serve as effective translators. While providing additional drive, these devices also add propagation delay and require directional control. In cases where additional drive is not - 3.3-V to 2.5-V Translation with Texas Instruments Crossbar Technology (Rev. A)PDF, 32 Kb, Revision: A, File published: Apr 3, 1998
- Bus FET Switch Solutions for Live Insertion ApplicationsPDF, 300 Kb, File published: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ - Texas Instruments Little Logic Application ReportPDF, 359 Kb, File published: Nov 1, 2002
Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, File published: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)PDF, 895 Kb, Revision: B, File published: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa - Selecting the Right Level Translation Solution (Rev. A)PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati - Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
Model Line
Series: SN54CBTD3384 (6)
- 5962-9752701Q3A 5962-9752701QKA 5962-9752701QLA SNJ54CBTD3384FK SNJ54CBTD3384JT SNJ54CBTD3384W
Manufacturer's Classification
- Semiconductors > Space & High Reliability > Logic Products > Switches and Multiplexer > Signal Switch
Other Names:
59629752701Q3A, 5962 9752701Q3A
