Datasheet Texas Instruments TPS79318YZQR

High PSRR, Low Noise, 200mA Single Output LDO, 5-DSBGA -40 to 125

Datasheets

PDF, 1.2 Mb, Revision: L, File published: Aug 7, 2014

Extract from the document

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	Yes

Accuracy	2 %
Fixed Output Options	1.8,2.5,2.8,2.85,3,3.3,4.75 V
Iout(Max)	0.2 A
Iq(Typ)	0.17 mA
Noise	32 uVrms
Operating Temperature Range	-40 to 125 C
Output Capacitor Type	Ceramic
Output Options	Adjustable Output,Fixed Output
PSRR @ 100KHz	44 dB
Package Group	DSBGA
Package Size: mm2:W x L	See datasheet (DSBGA) PKG
Rating	Catalog
Regulated Outputs	1
Special Features	Enable
Thermal Resistance ОёJA	178 В°C/W
Vdo(Typ)	112 mV
Vin(Max)	5.5 V
Vin(Min)	2.7 V
Vout(Max)	5.4 V
Vout(Min)	1.22 V

RoHS

Compliant

Evaluation Modules & Boards: TMDXEVM368
TMS320DM36x Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
- Download
- Download
Evaluation Modules & Boards: TPS793285YEQEVM
TPS793285Y Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
- Download
Evaluation Modules & Boards: TPS79325YEQEVM
Evaluation Module for TPS79325 chipscale LDO
Lifecycle Status: Active (Recommended for new designs)
- Download
Evaluation Modules & Boards: TPS79330YEQEVM
Evaluation Module for TPS79330 chipscale LDO
Lifecycle Status: Active (Recommended for new designs)
- Download
Evaluation Modules & Boards: TPS79328EVM
TPS79328 Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
- Download
Evaluation Modules & Boards: TPS79301EVM
TPS79301 Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
- Download
Evaluation Modules & Boards: DEM-SOT23LDO
DEM-SOT23LDO Compatible With Most Positive-Output LDO Regulators in 5- or 6-Lead SOT23 (DBV) Package
Lifecycle Status: Active (Recommended for new designs)
- Download

Download
NanoStarв„ў Wafer Chip-Scale Package Design Guide
PDF, 286 Kb, File published: Sep 5, 2003
To satisfy market demand for an ultra-small, staggered 5-ball wafer-level chip-scale package, TI has introduced the 170Ојm NanoStar YEQ package. Since staggered ball WCSPs are not registered under the JEDEC MO-211 standard, there are no formal industry-standard guidelines on proper use of devices in this package. This application note gives guidelines for reliable, high-performance use of the YE
Download
NanoStarв„ў & NanoFreeв„ў 300Ојm Solder Bump WCSP Application
PDF, 749 Kb, File published: Feb 2, 2004
The NanoStarв„ў Wafer Chip-Scale Package (WCSP) is a family of bare die packages developed for applications that require the smallest possible package. WCSP provides electrical interconnection via solder spheres attached to the die and is aligned with JEDEC package standard MOв€’211. NanoStarв„ў, with advanced materials engineering technology, has demonstrated excellent board level rel
Download
Cycloneв„ў III FPGA Starter Kit Power Reference Design
PDF, 314 Kb, File published: Mar 27, 2008
This power supply was designed to power the 3C25F324 starter kit. This reference design has many benefits over the existing power supply found on the starter kit demonstration board.

Series: TPS793 (34)