Datasheet Texas Instruments SN74AVC4T245DBR

ManufacturerTexas Instruments
SeriesSN74AVC4T245
Part NumberSN74AVC4T245DBR
Datasheet Texas Instruments SN74AVC4T245DBR

4-Bit Dual-Supply Bus Transceiver with Configurable Voltage-Level Shifting and 3-State Outputs 16-SSOP -40 to 85

Datasheets

SN74AVC4T245 Dual-Bit Bus Transceiver with Configurable Voltage Translation and 3-State Outputs datasheet
PDF, 1.5 Mb, Revision: G, File published: Nov 5, 2014
Extract from the document

Prices

Status

Lifecycle StatusPreview (Device has been announced but is not in production. Samples may or may not be available)
Manufacture's Sample AvailabilityNo

Packaging

Pin16
Package TypeDB
Industry STD TermSSOP
JEDEC CodeR-PDSO-G
Package QTY2000
CarrierLARGE T&R
Width (mm)5.3
Length (mm)6.2
Thickness (mm)1.95
Pitch (mm).65
Max Height (mm)2
Mechanical DataDownload

Parametrics

Approx. Price (US$)0.35 | 1ku
Bits(#)4
F @ Nom Voltage(Max)(Mhz)100
ICC @ Nom Voltage(Max)(mA)0.016
Operating Temperature Range(C)-40 to 85
Package GroupSSOP
Package Size: mm2:W x L (PKG)16TSSOP: 32 mm2: 6.4 x 5(TSSOP)
RatingCatalog
Schmitt TriggerNo
Technology FamilyAVC
VCC(Max)(V)3.6
VCC(Min)(V)1.2
Voltage(Nom)(V)1.2
1.5
1.8
2.5
3.3
tpd @ Nom Voltage(Max)(ns)3.4
3.2
2.9
2.8

Eco Plan

RoHSNot Compliant
Pb FreeNo

Design Kits & Evaluation Modules

  • Evaluation Modules & Boards: ADS7056EVM-PDK
    ADS7056 Ultra-Low-Power Ultra-Small-Size 14-Bit High-Speed SAR ADC Evaluation Module PDK
    Lifecycle Status: Preview (Device has been announced but is not in production. Samples may or may not be available)
  • Evaluation Modules & Boards: MSP-EXP432P401R
    SimpleLinkв„ў MSP432P401R LaunchPadв„ў Development Kit
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: LAUNCHXL-CC1350-4
    CC1350 Dualband Launchpad for 433MHz/2.4GHz Applications
    Lifecycle Status: Preview (Device has been announced but is not in production. Samples may or may not be available)
  • Daughter Cards: AUDK2G
    66AK2Gx (K2G) Audio Daughter Card
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSCSK8127
    TMS320DM8127 Camera Starter Kit (CSK)
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSCSK369
    TMS320DM36x Camera Starter Kit (CSK)
    Lifecycle Status: Active (Recommended for new designs)
  • Development Kits: DLPLIGHTCRAFTER
    DLPВ® LightCrafterв„ў Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSCSK388
    DM38x Camera Starter Kit (CSK)
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: EVMK2G
    66AK2Gx (K2G) Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • Dynamic Output Control (DOC) Circuitry Technology And Applications (Rev. B)
    PDF, 126 Kb, Revision: B, File published: Jul 7, 1999
    Texas Instruments (TI[TM]) next-generation logic is called the Advanced Very-low-voltage CMOS (AVC) family. The AVCfamily features TI?s Dynamic Output Control (DOC[TM]) circuit (patent pending). DOC circuitry automatically lowers the outputimpedance of the circuit at the beginning of a signal transition, providing enough current to achieve high signaling speeds, thensubsequently raises the i
  • AVC Logic Family Technology and Applications (Rev. A)
    PDF, 148 Kb, Revision: A, File published: Aug 26, 1998
    Texas Instruments (TI?) announces the industry?s first logic family to achieve maximum propagation delays of less than 2 ns at 2.5 V. TI?s next-generation logic is the Advanced Very-low-voltage CMOS (AVC) family. Although optimized for 2.5-V systems, AVC logic supports mixed-voltage systems because it is compatible with 3.3-V and 1.8-V devices. The AVC family features TI?s Dynamic Output Control (
  • Voltage Translation Between 3.3-V, 2.5-V, 1.8-V, and 1.5-V Logic Standards (Rev. B)
    PDF, 390 Kb, Revision: B, File published: Apr 30, 2015
  • 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
    PDF, 895 Kb, Revision: B, File published: May 22, 2002
    TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa

Model Line

Manufacturer's Classification

  • Semiconductors > Logic > Voltage Level Translation > Direction Controlled Voltage Translation