Datasheet Texas Instruments LM2675MX-3.3
| Manufacturer | Texas Instruments |
| Series | LM2675 |
| Part Number | LM2675MX-3.3 |
SIMPLE SWITCHERВ® 6.5V to 40V, 1A Low Component Count Step-Down Regulator 8-SOIC -40 to 125
Datasheets
LM2675 SIMPLE SWITCHERВ® Power Converter High Efficiency 1-A Step-Down Voltage Regulator datasheet
PDF, 1.2 Mb, Revision: F, File published: Jun 29, 2016
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Prices
Status
| Lifecycle Status | NRND (Not recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 8 | 8 |
| Package Type | D | D |
| Industry STD Term | SOIC | SOIC |
| JEDEC Code | R-PDSO-G | R-PDSO-G |
| Device Marking | M3.3 | 2675 |
| Width (mm) | 3.91 | 3.91 |
| Length (mm) | 4.9 | 4.9 |
| Thickness (mm) | 1.58 | 1.58 |
| Pitch (mm) | 1.27 | 1.27 |
| Max Height (mm) | 1.75 | 1.75 |
| Mechanical Data | Download | Download |
Replacements
| Replacement | LM2675MX-3.3/NOPB |
| Replacement Code | S |
Parametrics
| Approx. Price (US$) | 1.60 | 1ku |
| Control Mode | Voltage Mode |
| Duty Cycle(Max)(%) | 95 |
| Iout(Max)(A) | 1 |
| Iq(Typ)(mA) | 2.5 |
| Operating Temperature Range(C) | -40 to 125 |
| Package Group | SOIC |
| Rating | Catalog |
| Regulated Outputs(#) | 1 |
| Special Features | Enable |
| Switching Frequency(Max)(kHz) | 260 |
| Switching Frequency(Min)(kHz) | 260 |
| Type | Converter |
| Vin(Max)(V) | 40 |
| Vin(Min)(V) | 6.5 |
| Vout(Max)(V) | 37 |
| Vout(Min)(V) | 1.23 |
Eco Plan
| RoHS | Not Compliant |
| Pb Free | No |
Design Kits & Evaluation Modules
- Evaluation Modules & Boards: LM2675-5.0EVAL
SIMPLE SWITCHER Power Converter High Efficiency 1A Step-Down Voltage Regulator Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- AN-643 EMI/RFI Board Design (Rev. B)PDF, 742 Kb, Revision: B, File published: May 3, 2004
Application Note 643 EMI/RFI Board Design - AN-1187 Leadless Leadframe Package (LLP) (Rev. R)PDF, 21.3 Mb, Revision: R, File published: May 7, 2013
This application report discusses the Leadless Leadframe Package (LLP). - Input and Output Capacitor SelectionPDF, 219 Kb, File published: Sep 19, 2005
- AN-1197 Selecting Inductors for Buck Converters (Rev. B)PDF, 558 Kb, Revision: B, File published: Apr 23, 2013
This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application. - AN-1Positive-to-Negative Buck-Boost Converter Using LM267x SIMPLE SWITCHER (Rev. E)PDF, 291 Kb, Revision: E, File published: Apr 23, 2013
The third generation Simple Switcher LM267X series of regulators are monolithic integrated circuits withan internal MOSFET switch. These regulators are simple to use and require only a few externalcomponents. In this article the design of a polarity inverting converter will be discussed. - AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor. - AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)PDF, 1.4 Mb, Revision: A, File published: Apr 23, 2013
This application note provides thermal power analysis techniques for analyzing the power IC. - AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)PDF, 2.7 Mb, Revision: A, File published: Apr 23, 2013
This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time. - Semiconductor and IC Package Thermal Metrics (Rev. C)PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
- Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)PDF, 512 Kb, Revision: A, File published: Sep 12, 2014
Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x - Simple Techniques Minimize Cross-Coupling in Distributed Power SystemsPDF, 335 Kb, File published: Mar 21, 2007
- AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)PDF, 82 Kb, Revision: C, File published: Apr 23, 2013
When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current - AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)PDF, 374 Kb, Revision: C, File published: Apr 23, 2013
This application report provides SIMPLE SWITCHER™ PCB layout guidelines. - AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti - AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)PDF, 427 Kb, Revision: C, File published: Apr 23, 2013
This application note discusses stresses in wide input DC-DC converters. - AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
Model Line
Series: LM2675 (19)
- LM2675LD-5.0 LM2675LD-5.0/NOPB LM2675LD-ADJ/NOPB LM2675M-12 LM2675M-12/NOPB LM2675M-3.3/NOPB LM2675M-5.0 LM2675M-5.0/NOPB LM2675M-ADJ LM2675M-ADJ/NOPB LM2675MX-12/NOPB LM2675MX-3.3 LM2675MX-3.3/NOPB LM2675MX-5.0/NOPB LM2675MX-ADJ/NOPB LM2675N-12/NOPB LM2675N-3.3/NOPB LM2675N-5.0/NOPB LM2675N-ADJ/NOPB
Manufacturer's Classification
- Semiconductors > Power Management > Non-isolated DC/DC Switching Regulator > Step-Down (Buck) > Buck Converter (Integrated Switch)
Other Names:
LM2675MX3.3, LM2675MX 3.3
