Datasheet Texas Instruments 5962-8753301LA

ManufacturerTexas Instruments
SeriesSN54ALS857
Part Number5962-8753301LA
Datasheet Texas Instruments 5962-8753301LA

Hex 2-To-1 Universal Multiplexers With 3-State Outputs 24-CDIP -55 to 125

Datasheets

Hex 2-to-1 Universal Multiplexers With 3-State Outputs datasheet
PDF, 150 Kb, Revision: A, File published: Jan 1, 1995
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin24
Package TypeJT
Industry STD TermCDIP
JEDEC CodeR-GDIP-T
Package QTY1
CarrierTUBE
Width (mm)6.92
Length (mm)32
Thickness (mm)4.7
Pitch (mm)2.54
Max Height (mm)5.08
Mechanical DataDownload

Parametrics

Number of Channels6
F @ Nom Voltage(Max)75 Mhz
ICC @ Nom Voltage(Max)36 mA
Operating Temperature Range-55 to 125 C
Package GroupCDIP
Package Size: mm2:W x LSee datasheet (CDIP) PKG
RatingMilitary
Schmitt TriggerNo
Technology FamilyALS
VCC(Max)5.5 V
VCC(Min)4.5 V
Voltage(Nom)5 V
tpd @ Nom Voltage(Max)37 ns

Eco Plan

RoHSSee ti.com

Application Notes

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    PDF, 1.9 Mb, File published: Aug 1, 1995
    This document introduces the advanced Schottky family of clamped TTL integrated circuits (ICs). Detailed electrical characteristics of the 'AS and 'ALS devices with table formats are provided. Guidelines for designing high-performance digital systems using the Advanced Schottky family are given along with a brief summary of the solutions to most design decisions needed to implement systems using t
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Live Insertion
    PDF, 150 Kb, File published: Oct 1, 1996
    Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, File published: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con

Model Line

Manufacturer's Classification

  • Semiconductors > Space & High Reliability > Logic Products > Specialty Logic Products > Decoders/Encoders/Multiplexers

Other Names:

59628753301LA, 5962 8753301LA