Datasheet Texas Instruments AM26LV32CDG4
| Manufacturer | Texas Instruments |
| Series | AM26LV32 |
| Part Number | AM26LV32CDG4 |
Low-Voltage High-Speed Quadruple Differential Line Receiver 16-SOIC 0 to 70
Datasheets
AM26LV32 Low-Voltage, High-Speed Quadruple Differential Line Receiver datasheet
PDF, 1.0 Mb, Revision: F, File published: Nov 18, 2016
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Packaging
| Pin | 16 |
| Package Type | D |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 40 |
| Carrier | TUBE |
| Device Marking | AM26LV32C |
| Width (mm) | 3.91 |
| Length (mm) | 9.9 |
| Thickness (mm) | 1.58 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 1.75 |
| Mechanical Data | Download |
Parametrics
| ICC(Max) | 17 mA |
| Operating Temperature Range | -40 to 85,0 to 70 C |
| Package Group | SOIC |
| Rating | Catalog |
| Signaling Rate | 32 Mbps |
| Supply Voltage(s) | 3.3 V |
Eco Plan
| RoHS | Compliant |
Application Notes
- Wave Solder Exposure of SMT PackagesPDF, 206 Kb, File published: Sep 9, 2008
It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.
Model Line
Series: AM26LV32 (17)
Manufacturer's Classification
- Semiconductors > Interface > RS-485/RS-422
