Datasheet Texas Instruments 5962-9760501Q2A
| Manufacturer | Texas Instruments |
| Series | SN54LVC04A |
| Part Number | 5962-9760501Q2A |
HEX INVERTERS 20-LCCC -55 to 125
Datasheets
SNx4LVC04A Hex Inverters datasheet
PDF, 1.4 Mb, Revision: T, File published: Dec 12, 2016
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 20 | 20 | 20 | 20 |
| Package Type | FK | FK | FK | FK |
| Industry STD Term | LCCC | LCCC | LCCC | LCCC |
| JEDEC Code | S-CQCC-N | S-CQCC-N | S-CQCC-N | S-CQCC-N |
| Package QTY | 1 | 1 | 1 | 1 |
| Carrier | TUBE | TUBE | TUBE | TUBE |
| Device Marking | 9760501Q2A | 04AFK | SNJ54LVC | 5962- |
| Width (mm) | 8.89 | 8.89 | 8.89 | 8.89 |
| Length (mm) | 8.89 | 8.89 | 8.89 | 8.89 |
| Thickness (mm) | 1.83 | 1.83 | 1.83 | 1.83 |
| Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 |
| Max Height (mm) | 2.03 | 2.03 | 2.03 | 2.03 |
| Mechanical Data | Download | Download | Download | Download |
Parametrics
| Bits | 6 |
| Input Type | CMOS,TTL |
| Operating Temperature Range | -55 to 125 C |
| Output Type | LVTTL |
| Package Group | LCCC |
| Package Size: mm2:W x L | 20LCCC: 79 mm2: 8.89 x 8.89(LCCC) PKG |
| Rating | Military |
| Schmitt Trigger | No |
| Technology Family | LVC |
| VCC(Max) | 3.6 V |
| VCC(Min) | 2 V |
| Voltage(Nom) | 2.7,3.3 V |
Eco Plan
| RoHS | See ti.com |
Application Notes
- LVC Characterization InformationPDF, 114 Kb, File published: Dec 1, 1996
This document provides characterization information about low-voltage logic (LVL) that operates from a 3.3-V power supply. It addresses the issues of interfacing to 5-V logic ac performance power considerations input and output characteristics and signal integrity for this family of devices. - Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, File published: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - How to Select Little Logic (Rev. A)PDF, 1.1 Mb, Revision: A, File published: Jul 26, 2016
TI Little Logic devices are logic-gate devices assembled in a small single- dual- or triple- gate package. Little Logic devices are widely used in portable equipment such as mobile phones MP3 players and notebook computers. Little Logic devices also are used in desktop computers and telecommunications. Little Logic gates are common components for easy PC board routing schematic design and b - Understanding Advanced Bus-Interface Products Design GuidePDF, 253 Kb, File published: May 1, 1996
- Selecting the Right Texas Instruments Signal SwitchPDF, 769 Kb, File published: Sep 7, 2001
Texas Instruments offers a wide variety of electronic switches (digital analog bilateral bilateral analog) in a variety of families including CBT CBTLV HC LV and LVC. Depending on the application the right solution may be an analog switch that passes digital signals or vice versa. This application report summarizes the various switching technologies and provides considerations for choosi - Migration From 3.3-V To 2.5-V Power Supplies For Logic DevicesPDF, 115 Kb, File published: Dec 1, 1997
This application report explores the possibilities for migrating to 3.3-V and 2.5-V power supplies and discusses the implications.Customers are successfully using a wide range of low-voltage 3.3-V logic devices. These devices are within Texas Instruments (TI) advanced low-voltage CMOS (ALVC) crossbar technology (CBT) crossbar technology with integrated diode (CBTD) low-voltage crossbar techn - TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, File published: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Live InsertionPDF, 150 Kb, File published: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Power-Up 3-State (PU3S) Circuits in TI Standard Logic DevicesPDF, 209 Kb, File published: May 10, 2002
Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features - Use of the CMOS Unbuffered Inverter in Oscillator CircuitsPDF, 796 Kb, File published: Nov 6, 2003
CMOS devices have a high input impedance high gain and high bandwidth. These characteristics are similar to ideal amplifier characteristics and hence a CMOS buffer or inverter can be used in an oscillator circuit in conjunction with other passive components. Now CMOS oscillator circuits are widely used in high-speed applications because they are economical easy to use and take significantly - Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi - Texas Instruments Little Logic Application ReportPDF, 359 Kb, File published: Nov 1, 2002
Portable and consumer electronic systems? needs present greater challenges today than ever before. Engineers strive to design smaller faster lower-cost systems to meet the market demand. Consequently the semiconductor industry faces a growing need to increase operating speed minimize power consumption and reduce packaging size. Texas Instruments manufactures a variety of Little Logic semicond - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, File published: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - 16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)PDF, 895 Kb, Revision: B, File published: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa - Selecting the Right Level Translation Solution (Rev. A)PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati - Introduction to LogicPDF, 93 Kb, File published: Apr 30, 2015
- Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
- CMOS Power Consumption and CPD Calculation (Rev. B)PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
Model Line
Series: SN54LVC04A (6)
- 5962-9760501Q2A 5962-9760501QCA 5962-9760501QDA SNJ54LVC04AFK SNJ54LVC04AJ SNJ54LVC04AW
Manufacturer's Classification
- Semiconductors > Space & High Reliability > Logic Products > Buffers/Drivers/Transceivers > Buffer Drivers
Other Names:
59629760501Q2A, 5962 9760501Q2A
