Datasheet Texas Instruments 5962-9751601QCA
Manufacturer | Texas Instruments |
Series | SN54S15 |
Part Number | 5962-9751601QCA |
Triple 3-Input Positive-AND Gates With Open-Collector Outputs 14-CDIP -55 to 125
Datasheets
Datasheet
Prices
Status
Lifecycle Status | Obsolete (Manufacturer has discontinued the production of the device) |
Manufacture's Sample Availability | No |
Packaging
Pin | 14 |
Package Type | J |
Industry STD Term | CDIP |
JEDEC Code | R-GDIP-T |
Width (mm) | 6.67 |
Length (mm) | 19.56 |
Thickness (mm) | 4.57 |
Pitch (mm) | 2.54 |
Max Height (mm) | 5.08 |
Mechanical Data | Download |
Eco Plan
RoHS | Not Compliant |
Pb Free | No |
Application Notes
- Input and Output Characteristics of Digital Integrated CircuitsPDF, 1.7 Mb, File published: Oct 1, 1996
This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou - Live InsertionPDF, 150 Kb, File published: Oct 1, 1996
Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha - Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, File published: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, File published: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Designing With Logic (Rev. C)PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
Model Line
Series: SN54S15 (5)
- 5962-9751601QCA SN54S15J SNJ54S15FK SNJ54S15J SNJ54S15W
Manufacturer's Classification
- Semiconductors > Space & High Reliability > Logic Products > Gate Products
Other Names:
59629751601QCA, 5962 9751601QCA