Datasheet Texas Instruments MSP430FR2032IPM
| Manufacturer | Texas Instruments |
| Series | MSP430FR2032 |
| Part Number | MSP430FR2032IPM |
MSP430FR203x Mixed-Signal Microcontrollers 64-LQFP -40 to 85
Datasheets
MSP430FR203x Mixed-Signal Microcontrollers datasheet
PDF, 1.7 Mb, Revision: B, File published: Aug 14, 2015
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 64 |
| Package Type | PM |
| Industry STD Term | LQFP |
| JEDEC Code | S-PQFP-G |
| Package QTY | 160 |
| Carrier | JEDEC TRAY (10+1) |
| Device Marking | FR2032 |
| Width (mm) | 10 |
| Length (mm) | 10 |
| Thickness (mm) | 1.4 |
| Pitch (mm) | .5 |
| Max Height (mm) | 1.6 |
| Mechanical Data | Download |
Parametrics
| ADC | ADC10 - 10ch |
| AES | N/A |
| Active Power (uA/MHz) | 126 |
| Additional Features | Real-Time Clock Watchdog Temp Sensor Brown Out Reset |
| Approx. Price (US$) | 0.99 | 1ku |
| BSL | UART |
| CPU | MSP430 |
| Frequency(MHz) | 16 |
| GPIO Pins(#) | 60 |
| I2C | 1 |
| Max VCC | 3.6 |
| Min VCC | 1.8 |
| Multiplier | N/A |
| Non-volatile Memory (KB) | 8 |
| Operating Temperature Range(C) | -40 to 85 |
| Package Group | LQFP |
| Package Size: mm2:W x L (PKG) | 64LQFP: 144 mm2: 12 x 12(LQFP) |
| RAM(KB) | 1 |
| Rating | Catalog |
| SPI | 2 |
| Special I/O | N/A |
| Standby Power (LPM3-uA) | 1.31 |
| Timers - 16-bit | 2 |
| UART | 1 |
| Wakeup Time (us) | 10 |
Eco Plan
| RoHS | Compliant |
| Pb Free | Yes |
Design Kits & Evaluation Modules
- Evaluation Modules & Boards: MSP-EXP430FR4133
MSP430FR4133 LaunchPad Development Kit
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: MSP-TS430PM64D
MSP-TS430PM64D - 64-pin Target Development Board for MSP430FRxx FRAM MCUs
Lifecycle Status: Active (Recommended for new designs) - Daughter Cards: BOOST-IR
Infrared (IR) BoosterPack Plug-in Module
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Migrating from the MSP430F4xx to Family to the MSP430FR4xx FamilyPDF, 194 Kb, File published: Oct 3, 2014
This application report enables easy migration from MSP430F4xx flash-based MCUs to the MSP430FR4xx/FR2xx family of FRAM-based MCUs. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx/FR2xx devices, see the MSP430FR4xx and MSP430FR2xx Family User - Infrared Remote Control Implementation With MSP430FR4xx (Rev. B)PDF, 329 Kb, Revision: B, File published: Jun 30, 2015
This application report provides an insight into several of the most frequently used infrared protocols and especially their flexible implementation using the TI MSP430FR4xx series of low-power microcontrollers.The MSP430FR4xx microcontrollers are primarily targeted at remote control application that are equipped with infrared modulation function and an LCD display. The infrared modulation combi - VLO Calibration on the MSP430FR4xx and MSP430FR2xx Family (Rev. A)PDF, 78 Kb, Revision: A, File published: Feb 19, 2016
MSP430FR4xx and MSP430FR2xx (FR4xx/FR2xx) family microcontrollers (MCUs) provide various clock sources, including some high-speed high-accuracy clocks and some low-power low-system-cost clocks. Users can select the best balance of performance, power consumption, and system cost. The on-chip very low-frequency oscillator (VLO) is a clock source with 10-kHz typical frequency included in FR4xx/FR2xx - MSP430 FRAM Technology – How To and Best PracticesPDF, 326 Kb, File published: Jun 23, 2014
FRAM is a non-volatile memory technology that behaves similar to SRAM while enabling a whole host of new applications, but also changing the way firmware should be designed. This application report outlines the how to and best practices of using FRAM technology in MSP430 from an embedded software development perspective. It discusses how to implement a memory layout according to application-specif - MSP430 FRAM Quality and Reliability (Rev. A)PDF, 295 Kb, Revision: A, File published: May 1, 2014
FRAM is a nonvolatile embedded memory technology and is known for its ability to be ultra-low power while being the most flexible and easy-to-use universal memory solution available today. This application report is intended to give new FRAM users and those migrating from flash-based applications knowledge on how FRAM meets key quality and reliability requirements such as data retention and endura - Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revision: E, File published: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430 - General Oversampling of MSP ADCs for Higher Resolution (Rev. A)PDF, 551 Kb, Revision: A, File published: Apr 1, 2016
Multiple MSP ultra-low-power microcontrollers offer analog-to-digital converters (ADCs) to convert physical quantities into digital numbers, a function that is widely used across numerous applications. There are times, however, when a customer design demands a higher resolution than the ADC of the selected MSP can offer. This application report, which is based on the previously-published Oversampl
Model Line
Series: MSP430FR2032 (6)
Manufacturer's Classification
- Semiconductors > Microcontrollers (MCU) > MSP430 ultra-low-power MCUs > MSP430FRxx FRAM
