Datasheet Texas Instruments ISO7831FDWR
| Manufacturer | Texas Instruments |
| Series | ISO7831 |
| Part Number | ISO7831FDWR |
High-Immunity, 5.7kVRMS Reinforced Triple-Channel 2/1 Digital Isolator, 100Mbps 16-SOIC -55 to 125
Datasheets
ISO7831x High-Performance, 8000-VPK Reinforced Triple Digital Isolators datasheet
PDF, 1.4 Mb, Revision: B, File published: Jun 28, 2016
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Packaging
| Pin | 16 |
| Package Type | DW |
| Industry STD Term | SOIC |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | ISO7831F |
| Width (mm) | 7.5 |
| Length (mm) | 10.3 |
| Thickness (mm) | 2.35 |
| Pitch (mm) | 1.27 |
| Max Height (mm) | 2.65 |
| Mechanical Data | Download |
Parametrics
| Data Rate(Max) | 100 Mbps |
| Default Output | Low |
| Forward/Reverse Channels | 2/1 |
| Integrated Isolated Power | No |
| Isolation Rating | 5700 Vrms |
| Number of Channels | 3 |
| Operating Temperature Range | -55 to 125 C |
| Package Group | SOIC |
| Package Size: mm2:W x L | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) PKG |
| Propagation Delay | 10.7 ns |
| Propagation Delay(Typ) | 10.7 ns |
| Rating | Catalog |
| Surge Voltage Rating | 8000 Vpk |
| VCC(Max) | 5.5 V |
| VCC(Min) | 2.25 V |
Eco Plan
| RoHS | Compliant |
Design Kits & Evaluation Modules
- Evaluation Modules & Boards: LMG3410-HB-EVM
LMG3410 Daughter Card
Lifecycle Status: Active (Recommended for new designs) - Evaluation Modules & Boards: ISO7842-EVM
High-Immunity, 5.7kVRMS Reinforced Quad-Channel 2/2 Digital Isolator Evaluation Module
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, File published: Oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, File published: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, File published: Oct 30, 2015
- Isolation GlossaryPDF, 52 Kb, File published: Oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revision: A, File published: Nov 4, 2014
Model Line
Series: ISO7831 (8)
Manufacturer's Classification
- Semiconductors > Isolation > Digital Isolators
