Datasheet Texas Instruments 74AC16373

Manufacturer	Texas Instruments
Series	74AC16373

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Packaging

Parametrics

Parameters / Models	74AC16373DL	74AC16373DLG4	74AC16373DLR	74AC16373DLRG4
3-State Output	Yes	Yes	Yes	Yes
Bits	16	16	16	16
F @ Nom Voltage(Max), Mhz	100	100	100	100
ICC @ Nom Voltage(Max), mA	0.08	0.08	0.08	0.08
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Output Drive (IOL/IOH)(Max), mA	24/-24	24/-24	24/-24	24/-24
Package Group	SSOP	SSOP	SSOP	SSOP
Package Size: mm2:W x L, PKG	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)	48SSOP: 164 mm2: 10.35 x 15.88(SSOP)
Rating	Catalog	Catalog	Catalog	Catalog
Schmitt Trigger	No	No	No	No
Technology Family	AC	AC	AC	AC
VCC(Max), V	5.5	5.5	5.5	5.5
VCC(Min), V	3	3	3	3
Voltage(Nom), V	3.3,5	3.3,5	3.3,5	3.3,5
tpd @ Nom Voltage(Max), ns	14.8,10.1	14.8,10.1	14.8,10.1	14.8,10.1

Eco Plan

Application Notes

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  Live Insertion
  PDF, 150 Kb, File published: Oct 1, 1996
  Many applications require the ability to exchange modules in electronic systems without removing the supply voltage from the module (live insertion). For example an electronic telephone exchange must always remain operational even during module maintenance and repair. To avoid damaging components additional circuitry modifications are necessary. This document describes in detail the phenomena tha
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  Introduction to Logic
  PDF, 93 Kb, File published: Apr 30, 2015
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  Implications of Slow or Floating CMOS Inputs (Rev. D)
  PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
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  Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
  PDF, 337 Kb, File published: Jul 8, 2004
  Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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  Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
  PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
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  TI IBIS File Creation Validation and Distribution Processes
  PDF, 380 Kb, File published: Aug 29, 2002
  The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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  CMOS Power Consumption and CPD Calculation (Rev. B)
  PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
  Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale
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  Input and Output Characteristics of Digital Integrated Circuits
  PDF, 1.7 Mb, File published: Oct 1, 1996
  This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
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  Power-Up Behavior of Clocked Devices (Rev. A)
  PDF, 34 Kb, Revision: A, File published: Feb 6, 2015
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  Designing With Logic (Rev. C)
  PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
  Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
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  Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc
  PDF, 43 Kb, File published: Apr 1, 1996
  Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren

Model Line

Manufacturer's Classification

• Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Latch