Datasheet Texas Instruments AM26LS33A

ManufacturerTexas Instruments
SeriesAM26LS33A
Datasheet Texas Instruments AM26LS33A

Quadruple Differential Line Receiver

Datasheets

AM26LS32Ax, AM26LS33Ax Quadruple Differential Line Receivers datasheet
PDF, 1.4 Mb, Revision: F, File published: Sep 19, 2016
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Prices

Status

AM26LS33ACDAM26LS33ACDG4AM26LS33ACDRAM26LS33ACDRE4AM26LS33ACDRG4AM26LS33ACNAM26LS33ACNE4
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNo

Packaging

AM26LS33ACDAM26LS33ACDG4AM26LS33ACDRAM26LS33ACDRE4AM26LS33ACDRG4AM26LS33ACNAM26LS33ACNE4
N1234567
Pin16161616161616
Package TypeDDDDDNN
Industry STD TermSOICSOICSOICSOICSOICPDIPPDIP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDSO-GR-PDIP-TR-PDIP-T
Package QTY40402500250025002525
CarrierTUBETUBELARGE T&RLARGE T&RLARGE T&RTUBETUBE
Device Marking26LS33AC26LS33AC26LS33AC26LS33AC26LS33ACAM26LS33ACNAM26LS33ACN
Width (mm)3.913.913.913.913.916.356.35
Length (mm)9.99.99.99.99.919.319.3
Thickness (mm)1.581.581.581.581.583.93.9
Pitch (mm)1.271.271.271.271.272.542.54
Max Height (mm)1.751.751.751.751.755.085.08
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / ModelsAM26LS33ACD
AM26LS33ACD
AM26LS33ACDG4
AM26LS33ACDG4
AM26LS33ACDR
AM26LS33ACDR
AM26LS33ACDRE4
AM26LS33ACDRE4
AM26LS33ACDRG4
AM26LS33ACDRG4
AM26LS33ACN
AM26LS33ACN
AM26LS33ACNE4
AM26LS33ACNE4
ICC(Max), mA70707070707070
Operating Temperature Range, C0 to 700 to 700 to 700 to 700 to 700 to 700 to 70
Package GroupSOICSOICSOICSOICSOICPDIPPDIP
RatingCatalogCatalogCatalogCatalogCatalogCatalogCatalog
Supply Voltage(s), V5555555

Eco Plan

AM26LS33ACDAM26LS33ACDG4AM26LS33ACDRAM26LS33ACDRE4AM26LS33ACDRG4AM26LS33ACNAM26LS33ACNE4
RoHSCompliantCompliantCompliantCompliantCompliantCompliantCompliant
Pb FreeYesYes

Application Notes

  • Wave Solder Exposure of SMT Packages
    PDF, 206 Kb, File published: Sep 9, 2008
    It is common practice to attach surface mount components to the underside of a printed circuit board (PCB) by processing the PCB through a wave soldering operation after gluing the components to the PCB. This paper ummarizes results of several tests performed to understand the performance of surface mount components when exposed to the conditions outlined in JESD22A111.

Model Line

Manufacturer's Classification

  • Semiconductors> Interface> RS-422 Transceivers