Datasheet Texas Instruments AM3357BZCZA60

ManufacturerTexas Instruments
SeriesAM3357
Part NumberAM3357BZCZA60
Datasheet Texas Instruments AM3357BZCZA60

Sitara Processor: ARM Cortex-A8, EtherCAT, PRU-ICSS 324-NFBGA -40 to 105

Datasheets

AM335x Sitaraв„ў Processors datasheet
PDF, 3.2 Mb, Revision: J, File published: Apr 12, 2016
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityYes

Packaging

Pin324
Package TypeZCZ
Package QTY126
Device MarkingAM3357BZCZA60
Width (mm)15
Length (mm)15
Thickness (mm).9
Mechanical DataDownload

Parametrics

ARM CPU1 ARM Cortex-A8
ARM MHz300,600,800 Max.
ApplicationsAutomotive,Industrial,Personal Electronics
Co-Processor2 PRU-ICSS s
DMIPS600,1200,1600
DRAMDDR2,DDR3,DDR3L,LPDDR
Display Outputs1
EMAC2-Port 10/100 PRU EMAC,2-Port 1Gb Switch
Industrial Protocols1588,EtherCAT,EtherNet/IP,Ethernet POWERLINK,PROFIBUS,PROFINET RT/IRT,SERCOS III
On-Chip L2 Cache256 KB (ARM Cortex-A8)
Operating SystemsAndroid,Integrity,Linux,Neutrino,VxWorks,Windows Embedded CE
Operating Temperature Range-40 to 105,-40 to 90 C
Other On-Chip Memory128 KB
RatingCatalog
Security EnablerCryptographic acceleration,Debug security,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/OCAN,I2C,SPI,UART,USB

Eco Plan

RoHSCompliant

Design Kits & Evaluation Modules

  • Development Kits: TMDSICE3359
    AM3359 Industrial Communications Engine
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: PRUCAPE
    TI PRU Cape
    Lifecycle Status: Active (Recommended for new designs)
  • Daughter Cards: WL1835MODCOM8B
    WiLinkВ™ 8 Module 2.4 GHz WiFiВ® + BluetoothВ® COM8 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Daughter Cards: WL1837MODCOM8I
    WiLinkВ™ 8 Dual Band 2.4 & 5 GHz Wi-FiВ® + BluetoothВ® COM8 Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDSSK3358
    AM335x Starter Kit
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: BEAGLEBK
    BeagleBone Black Development Board
    Lifecycle Status: Active (Recommended for new designs)
  • Evaluation Modules & Boards: TMDXEVM3358
    AM335x Evaluation Module
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-U
    XDS560v2 System Trace USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU560V2STM-UE
    XDS560v2 System Trace USB & Ethernet Debug Probe
    Lifecycle Status: Active (Recommended for new designs)
  • JTAG Emulators/ Analyzers: TMDSEMU200-U
    XDS200 USB Debug Probe
    Lifecycle Status: Active (Recommended for new designs)

Application Notes

  • AM335x Power Estimation Tool
    PDF, 84 Kb, File published: May 31, 2017
    The Power Estimation ToolPower Estimation Tool (PET) allows you to gain insight into the power consumption of select Sitara processors. The tool includes the ability for you to choose multiple application scenarios and understand the power consumption as well as how advanced power saving techniques can be applied to further reduce overall power consumption.
  • AM335x Low Power Design Guide (Rev. A)
    PDF, 300 Kb, Revision: A, File published: Feb 28, 2017
    This document discusses techniques to develop a low power, low cost system based on the AM335x series processor. The goal is to explain how system design choices affect power consumption and how power consumption can vary significantly depending on how the developer’s application runs in that system under specific conditions.
  • AM335x Reliability Considerations in PLC Applications (Rev. A)
    PDF, 112 Kb, Revision: A, File published: Apr 27, 2017
    Programmable Logic Controllers (PLC) are used as the main control in an automation system with high-reliability expectations and long life in harsh environments. Processors used in these applications require an assessment of performance verses expected power on hours to achieve the optimal performance for the application.
  • Processor SDK RTOS Customization: Modifying Board library to change UART instanc
    PDF, 783 Kb, File published: Mar 4, 2016
  • AM335x Thermal Considerations
    PDF, 16 Kb, File published: Apr 15, 2013
    This article discusses the thermal considerations of the AM335x devices. It offers guidance on analysis of the processor's thermal performance, suggests improvements for an end system to aid in overcoming some of the existing challenges of producing a good thermal design, and provides real power/thermal data measured with AM335x EVMs for user evaluation.
  • Sitara Linux ALSA DSP Microphone Array Voice Recognition
    PDF, 529 Kb, File published: Jun 30, 2017
    Voice recognition applications requiring a superior user experience typically use a number of digital signal processing algorithms to filter, clean, and enhance microphone sampled audio. Frequently these systems will employ multiple microphones where more sophisticated algorithms can be used. These systems can leverage a Texas Instruments Digital Signal Processor to offload the complex real-time c
  • PRU-ICSS Migration Guide: AM335x to AM437x
    PDF, 59 Kb, File published: Apr 7, 2017
    This migration guide details the Programmable Real-Time Unit (PRU) subsystem hardware differences and outlines software modifications required for porting PRU firmware and ARMВ® code to AM437x.
  • PRU-ICSS Migration Guide: AM335x to AM57x (Rev. A)
    PDF, 71 Kb, Revision: A, File published: Jul 13, 2017
    This software migration guide assists in porting legacy software developed for the Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU-CSS) on AM335x to AM57x platforms.
  • nFBGA Packaging (Rev. B)
    PDF, 3.1 Mb, Revision: B, File published: Nov 13, 2015
    This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
  • 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
    PDF, 40.5 Mb, Revision: A, File published: Aug 9, 2015
  • Processor-SDK RTOS Power Management and Measurement
    PDF, 78 Kb, File published: Aug 2, 2017
    Processor-SDK RTOS provides out-of-the-box power management examples that empower customers to tailor Sitara processors’ (ARM and DSP) power-performance points per use case. You can configure all supported operating points and run CPU Idle and Dhrystone benchmarking workloads while employing a minimal kernel with real-time assurance. This application report provides an overview of the Processor-SD
  • PRU-ICSS Feature Comparison
    PDF, 29 Kb, File published: Jun 5, 2017
    This application report documents the feature differences between the PRU subsystems available on different TI processors.
  • Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
    PDF, 1.6 Mb, Revision: B, File published: Aug 13, 2015
  • High-Speed Interface Layout Guidelines (Rev. G)
    PDF, 814 Kb, Revision: G, File published: Jul 27, 2017
    As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Model Line

Manufacturer's Classification

  • Semiconductors > Processors > Sitara Processors > ARM Cortex-A8 > AM335x