Datasheet Texas Instruments AM4376
| Manufacturer | Texas Instruments |
| Series | AM4376 |
Sitara Processor
Datasheets
AM437x Sitaraв„ў Processors datasheet
PDF, 3.0 Mb, Revision: D, File published: Sep 14, 2016
Extract from the document
Prices
Status
| AM4376BZDN100 | AM4376BZDN80 | AM4376BZDNA100 | AM4376BZDNA80 | AM4376BZDND100 | AM4376BZDND30 | AM4376BZDND80 | |
|---|---|---|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Packaging
| AM4376BZDN100 | AM4376BZDN80 | AM4376BZDNA100 | AM4376BZDNA80 | AM4376BZDND100 | AM4376BZDND30 | AM4376BZDND80 | |
|---|---|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 | 6 | 7 |
| Pin | 491 | 491 | 491 | 491 | 491 | 491 | 491 |
| Package Type | ZDN | ZDN | ZDN | ZDN | ZDN | ZDN | ZDN |
| Package QTY | 90 | 90 | 90 | 90 | 90 | 90 | 90 |
| Device Marking | AM4376BZDN100 | AM4376BZDN80 | AM4376BZDNA100 | AM4376BZDNA80 | AM4376BZDND100 | AM4376BZDND30 | AM4376BZDND80 |
| Width (mm) | 17 | 17 | 17 | 17 | 17 | 17 | 17 |
| Length (mm) | 17 | 17 | 17 | 17 | 17 | 17 | 17 |
| Thickness (mm) | .9 | .9 | .9 | .9 | .9 | .9 | .9 |
| Mechanical Data | Download | Download | Download | Download | Download | Download | Download |
Parametrics
| Parameters / Models | AM4376BZDN100 | AM4376BZDN80 | AM4376BZDNA100 | AM4376BZDNA80 | AM4376BZDND100 | AM4376BZDND30 | AM4376BZDND80 |
|---|---|---|---|---|---|---|---|
| ARM CPU | 1 ARM Cortex-A9 | 1 ARM Cortex-A9 | 1 ARM Cortex-A9 | 1 ARM Cortex-A9 | 1 ARM Cortex-A9 | 1 ARM Cortex-A9 | 1 ARM Cortex-A9 |
| ARM MHz, Max. | 300,800,1000 | 300,800,1000 | 300,800,1000 | 300,800,1000 | 300,800,1000 | 300,800,1000 | 300,800,1000 |
| Applications | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics | Communications Equipment,Enterprise Systems,Industrial,Personal Electronics |
| Co-Processor, s | 4 PRU-ICSS | 4 PRU-ICSS | 4 PRU-ICSS | 4 PRU-ICSS | 4 PRU-ICSS | 4 PRU-ICSS | 4 PRU-ICSS |
| DMIPS | 750,2000,2500 | 750,2000,2500 | 750,2000,2500 | 750,2000,2500 | 750,2000,2500 | 750,2000,2500 | 750,2000,2500 |
| DRAM | DDR3,DDR3L,LPDDR2 | DDR3,DDR3L,LPDDR2 | DDR3,DDR3L,LPDDR2 | DDR3,DDR3L,LPDDR2 | DDR3,DDR3L,LPDDR2 | DDR3,DDR3L,LPDDR2 | DDR3,DDR3L,LPDDR2 |
| Display Outputs | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| EMAC | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch | 2-Port 10/100 PRU EMAC,2-Port 1Gb Switch |
| Graphics Acceleration | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
| Industrial Protocols | 1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter | 1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter | 1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter | 1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter | 1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter | 1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter | 1588,BiSS,EnDat 2.2,EtherNet/IP,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter |
| On-Chip L2 Cache | 256 KB (ARM Cortex-A9) | 256 KB (ARM Cortex-A9) | 256 KB (ARM Cortex-A9) | 256 KB (ARM Cortex-A9) | 256 KB (ARM Cortex-A9) | 256 KB (ARM Cortex-A9) | 256 KB (ARM Cortex-A9) |
| Operating Systems | Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE | Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE |
| Operating Temperature Range, C | -40 to 90,-40 to 105,0 to 90 | -40 to 90,-40 to 105,0 to 90 | -40 to 90,-40 to 105,0 to 90 | -40 to 90,-40 to 105,0 to 90 | -40 to 90,-40 to 105,0 to 90 | -40 to 90,-40 to 105,0 to 90 | -40 to 90,-40 to 105,0 to 90 |
| Other On-Chip Memory | 320 KB | 320 KB | 320 KB | 320 KB | 320 KB | 320 KB | 320 KB |
| Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
| Security Enabler | Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment | Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment |
| Serial I/O | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB | CAN,I2C,SPI,UART,USB |
| Video Input Ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Eco Plan
| AM4376BZDN100 | AM4376BZDN80 | AM4376BZDNA100 | AM4376BZDNA80 | AM4376BZDND100 | AM4376BZDND30 | AM4376BZDND80 | |
|---|---|---|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Application Notes
- Sitara AM437x DDR-Less System How-To Instructions and Benchmarks (Rev. A)PDF, 252 Kb, Revision: A, File published: Feb 21, 2017
This application report describes a system running EtherCAT slave with motor control leveraging the rich feature set of the Texas Instruments Sitara AM437x processor. The application on the Sitara AM437x Industrial Development Kit (IDK) EVM is demonstrated by utilizing internal SRAM, QSPI memory and eliminating external DDR completely. Benchmarking data is presented and shows no impact of the syst - nFBGA Packaging (Rev. B)PDF, 3.1 Mb, Revision: B, File published: Nov 13, 2015
This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts. - 0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)PDF, 40.5 Mb, Revision: A, File published: Aug 9, 2015
- Thermal Design Guide for DSP and ARM Application Processors (Rev. A)PDF, 324 Kb, Revision: A, File published: Aug 17, 2016
This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require - Plastic Ball Grid Array [PBGA] Application Note (Rev. B)PDF, 1.6 Mb, Revision: B, File published: Aug 13, 2015
- High-Speed Interface Layout Guidelines (Rev. G)PDF, 814 Kb, Revision: G, File published: Jul 27, 2017
As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.
Model Line
Series: AM4376 (7)
Manufacturer's Classification
- Semiconductors> Processors> Sitara Processors> ARM Cortex-A9> AM437x
