Datasheet Texas Instruments AM4377

Manufacturer	Texas Instruments
Series	AM4377

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	AM4377BZDNA100	AM4377BZDNA80	AM4377BZDND100	AM4377BZDND80
ARM CPU	1 ARM Cortex-A9	1 ARM Cortex-A9	1 ARM Cortex-A9	1 ARM Cortex-A9
ARM MHz, Max.	800,1000	800,1000	800,1000	800,1000
Applications	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics	Communications Equipment,Enterprise Systems,Industrial,Personal Electronics
Co-Processor, s	4 PRU-ICSS	4 PRU-ICSS	4 PRU-ICSS	4 PRU-ICSS
DMIPS	2000,2500	2000,2500	2000,2500	2000,2500
DRAM	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2	DDR3,DDR3L,LPDDR2
Display Outputs	1	1	1	1
EMAC	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch	2-Port 10/100 PRU EMAC,2-Port 1Gb Switch
Graphics Acceleration	N/A	N/A	N/A	N/A
Industrial Protocols	1588,BiSS,EnDat 2.2,EtherCAT,EtherNet/IP,Ethernet POWERLINK,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherCAT,EtherNet/IP,Ethernet POWERLINK,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherCAT,EtherNet/IP,Ethernet POWERLINK,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter	1588,BiSS,EnDat 2.2,EtherCAT,EtherNet/IP,Ethernet POWERLINK,HIPERFACE DSL,PROFIBUS,PROFINET RT/IRT,SERCOS III,Sigma Delta Filter
On-Chip L2 Cache	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)	256 KB (ARM Cortex-A9)
Operating Systems	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE	Android,Integrity,Linux,Neutrino,SYS/BIOS,VxWorks,Windows Embedded CE
Operating Temperature Range, C	-40 to 105,-40 to 90	-40 to 105,-40 to 90	-40 to 105,-40 to 90	-40 to 105,-40 to 90
Other On-Chip Memory	320 KB	320 KB	320 KB	320 KB
Rating	Catalog	Catalog	Catalog	Catalog
Security Enabler	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment	Cryptographic acceleration,Debug security,Device identity,Initial secure programming,Secure boot,Secure storage,Software IP protection,Trusted execution environment
Serial I/O	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB	CAN,I2C,SPI,UART,USB
Video Input Ports	1	1	1	1

Eco Plan

Application Notes

• Download
  Sitara AM437x DDR-Less System How-To Instructions and Benchmarks (Rev. A)
  PDF, 252 Kb, Revision: A, File published: Feb 21, 2017
  This application report describes a system running EtherCAT slave with motor control leveraging the rich feature set of the Texas Instruments Sitara AM437x processor. The application on the Sitara AM437x Industrial Development Kit (IDK) EVM is demonstrated by utilizing internal SRAM, QSPI memory and eliminating external DDR completely. Benchmarking data is presented and shows no impact of the syst
• Download
  nFBGA Packaging (Rev. B)
  PDF, 3.1 Mb, Revision: B, File published: Nov 13, 2015
  This application report provides technical background on nFBGA packages and explains how to use them to build advanced board layouts.
• Download
  0.65 mm Pitch Flip Chip Ball Grid Array Package Reference Guide (Rev. A)
  PDF, 40.5 Mb, Revision: A, File published: Aug 9, 2015
• Download
  Thermal Design Guide for DSP and ARM Application Processors (Rev. A)
  PDF, 324 Kb, Revision: A, File published: Aug 17, 2016
  This application report has been compiled to provide specific information and considerations regarding thermal design requirements for all DSP and ARM-based single and multi-core processors (collectively referred to as “processors”, “System-on-chip”, or “SoC”). The information contained within this document is intended to provide a minimum level of understanding with regards to the thermal require
• Download
  Plastic Ball Grid Array [PBGA] Application Note (Rev. B)
  PDF, 1.6 Mb, Revision: B, File published: Aug 13, 2015
• Download
  High-Speed Interface Layout Guidelines (Rev. G)
  PDF, 814 Kb, Revision: G, File published: Jul 27, 2017
  As modern bus interface frequencies scale higher, care must be taken in the printed circuit board (PCB) layout phase of a design to ensure a robust solution.

Model Line

Manufacturer's Classification

• Semiconductors> Processors> Sitara Processors> ARM Cortex-A9> AM437x