Datasheet Texas Instruments ISO5451
Manufacturer | Texas Instruments |
Series | ISO5451 |
Reinforced Isolated IGBT Gate Driver with High CMTI & Miller Clamp
Datasheets
ISO5451 High-CMTI 2.5-A and 5-A Isolated IGBT, MOSFET Gate Driver With Active Protection Features datasheet
PDF, 1.4 Mb, Revision: C, File published: Jan 16, 2017
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Prices
Status
ISO5451DW | ISO5451DWR | |
---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes | No |
Packaging
ISO5451DW | ISO5451DWR | |
---|---|---|
N | 1 | 2 |
Pin | 16 | 16 |
Package Type | DW | DW |
Industry STD Term | SOIC | SOIC |
JEDEC Code | R-PDSO-G | R-PDSO-G |
Package QTY | 40 | 2000 |
Carrier | TUBE | LARGE T&R |
Device Marking | ISO5451 | ISO5451 |
Width (mm) | 7.5 | 7.5 |
Length (mm) | 10.3 | 10.3 |
Thickness (mm) | 2.35 | 2.35 |
Pitch (mm) | 1.27 | 1.27 |
Max Height (mm) | 2.65 | 2.65 |
Mechanical Data | Download | Download |
Parametrics
Parameters / Models | ISO5451DW | ISO5451DWR |
---|---|---|
DIN V VDE V 0884-10 Working Voltage, Vpk | 1420 | 1420 |
DIN V VDE V 0884-10 Transient Overvoltage Rating, Vpk | 8000 | 8000 |
Enable/Disable Function | N/A | N/A |
Input VCC(Max), V | 5.5 | 5.5 |
Input VCC(Min), V | 3 | 3 |
Isolation Rating, Vrms | 5700 | 5700 |
Number of Channels | 1 | 1 |
Operating Temperature Range, C | -40 to 125 | -40 to 125 |
Output VCC/VDD(Max), V | 30 | 30 |
Output VCC/VDD(Min), V | 15 | 15 |
Package Group | SOIC | SOIC |
Package Size: mm2:W x L, PKG | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) |
Peak Output Current, A | 5 | 5 |
Power Switch | IGBT,SiCFET | IGBT,SiCFET |
Prop Delay, ns | 76 | 76 |
Prop Delay(Max), ns | 110 | 110 |
Eco Plan
ISO5451DW | ISO5451DWR | |
---|---|---|
RoHS | Compliant | Compliant |
Application Notes
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, File published: Oct 30, 2015
- 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, File published: Oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, File published: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - Isolation GlossaryPDF, 52 Kb, File published: Oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revision: A, File published: Nov 4, 2014
Model Line
Series: ISO5451 (2)
Manufacturer's Classification
- Semiconductors> Isolation> Isolated Gate Driver