Datasheet Texas Instruments ISO5851DWR
Manufacturer | Texas Instruments |
Series | ISO5851 |
Part Number | ISO5851DWR |
Reinforced Isolated IGBT Gate Driver with High CMTI & Miller Clamp 16-SOIC -40 to 125
Datasheets
ISO5851 High-CMTI 2.5-A and 5-A Isolated IGBT, MOSFET Gate Driver With Active Protection Features datasheet
PDF, 1.5 Mb, Revision: B, File published: Jan 16, 2017
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Prices
Status
Lifecycle Status | Active (Recommended for new designs) |
Manufacture's Sample Availability | No |
Packaging
Pin | 16 |
Package Type | DW |
Industry STD Term | SOIC |
JEDEC Code | R-PDSO-G |
Package QTY | 2000 |
Carrier | LARGE T&R |
Device Marking | ISO5851 |
Width (mm) | 7.5 |
Length (mm) | 10.3 |
Thickness (mm) | 2.35 |
Pitch (mm) | 1.27 |
Max Height (mm) | 2.65 |
Mechanical Data | Download |
Parametrics
DIN V VDE V 0884-10 Working Voltage | 2121 Vpk |
DIN V VDE V 0884-10 Transient Overvoltage Rating | 8000 Vpk |
Enable/Disable Function | N/A |
Input VCC(Max) | 5.5 V |
Input VCC(Min) | 3 V |
Isolation Rating | 5700 Vrms |
Number of Channels | 1 |
Operating Temperature Range | -40 to 125 C |
Output VCC/VDD(Max) | 30 V |
Output VCC/VDD(Min) | 15 V |
Package Group | SOIC |
Package Size: mm2:W x L | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) PKG |
Peak Output Current | 5 A |
Power Switch | IGBT,SiCFET |
Prop Delay | 76 ns |
Prop Delay(Max) | 110 ns |
Eco Plan
RoHS | Compliant |
Design Kits & Evaluation Modules
- Evaluation Modules & Boards: ISO5851EVM
ISO5851 Evaluation Module (EVM)
Lifecycle Status: Active (Recommended for new designs)
Application Notes
- Common-mode transient immunity for isolated gate driversPDF, 152 Kb, File published: Oct 30, 2015
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, File published: Oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, File published: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, File published: Oct 30, 2015
- Isolation GlossaryPDF, 52 Kb, File published: Oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revision: A, File published: Nov 4, 2014
Model Line
Manufacturer's Classification
- Semiconductors > Isolation > Isolated Gate Driver