Datasheet Texas Instruments ISO5851

ManufacturerTexas Instruments
SeriesISO5851
Datasheet Texas Instruments ISO5851

Reinforced Isolated IGBT Gate Driver with High CMTI & Miller Clamp

Datasheets

ISO5851 High-CMTI 2.5-A and 5-A Isolated IGBT, MOSFET Gate Driver With Active Protection Features datasheet
PDF, 1.5 Mb, Revision: B, File published: Jan 16, 2017
Extract from the document

Prices

Status

ISO5851DWISO5851DWR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYes

Packaging

ISO5851DWISO5851DWR
N12
Pin1616
Package TypeDWDW
Industry STD TermSOICSOIC
JEDEC CodeR-PDSO-GR-PDSO-G
Package QTY402000
CarrierTUBELARGE T&R
Device MarkingISO5851ISO5851
Width (mm)7.57.5
Length (mm)10.310.3
Thickness (mm)2.352.35
Pitch (mm)1.271.27
Max Height (mm)2.652.65
Mechanical DataDownloadDownload

Parametrics

Parameters / ModelsISO5851DW
ISO5851DW
ISO5851DWR
ISO5851DWR
DIN V VDE V 0884-10 Working Voltage, Vpk21212121
DIN V VDE V 0884-10 Transient Overvoltage Rating, Vpk80008000
Enable/Disable FunctionN/AN/A
Input VCC(Max), V5.55.5
Input VCC(Min), V33
Isolation Rating, Vrms57005700
Number of Channels11
Operating Temperature Range, C-40 to 125-40 to 125
Output VCC/VDD(Max), V3030
Output VCC/VDD(Min), V1515
Package GroupSOICSOIC
Package Size: mm2:W x L, PKG16SOIC: 106 mm2: 10.3 x 10.3(SOIC)16SOIC: 106 mm2: 10.3 x 10.3(SOIC)
Peak Output Current, A55
Power SwitchIGBT,SiCFETIGBT,SiCFET
Prop Delay, ns7676
Prop Delay(Max), ns110110

Eco Plan

ISO5851DWISO5851DWR
RoHSCompliantCompliant

Application Notes

  • Common-mode transient immunity for isolated gate drivers
    PDF, 152 Kb, File published: Oct 30, 2015
  • Pushing the envelope with high-performance digital-isolation technology
    PDF, 147 Kb, File published: Oct 30, 2015
  • 4Q 2015 Analog Applications Journal
    PDF, 1.6 Mb, File published: Oct 30, 2015
  • Shelf-Life Evaluation of Lead-Free Component Finishes
    PDF, 1.3 Mb, File published: May 24, 2004
    The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a
  • Isolation Glossary
    PDF, 52 Kb, File published: Oct 27, 2014
  • Digital Isolator Design Guide (Rev. A)
    PDF, 487 Kb, Revision: A, File published: Nov 4, 2014

Model Line

Series: ISO5851 (2)

Manufacturer's Classification

  • Semiconductors> Isolation> Isolated Gate Driver