Datasheet Texas Instruments ISO7842
Manufacturer | Texas Instruments |
Series | ISO7842 |
5.7 kVrms, 100 Mbps, Reinforced 4-Channel 2/2 Digital Isolator
Datasheets
ISO7842x High-Performance, 8000-VPK Reinforced Quad-Channel Digital Isolator datasheet
PDF, 1.4 Mb, Revision: G, File published: Mar 2, 2017
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Prices
Status
ISO7842DW | ISO7842DWR | ISO7842DWW | ISO7842DWWR | ISO7842FDW | ISO7842FDWR | ISO7842FDWW | ISO7842FDWWR | |
---|---|---|---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes | Yes | Yes | No | Yes | No | No | No |
Packaging
ISO7842DW | ISO7842DWR | ISO7842DWW | ISO7842DWWR | ISO7842FDW | ISO7842FDWR | ISO7842FDWW | ISO7842FDWWR | |
---|---|---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 |
Pin | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Package Type | DW | DW | DWW | DWW | DW | DW | DWW | DWW |
Industry STD Term | SOIC | SOIC | SOIC | SOIC | ||||
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | ||||
Package QTY | 40 | 2000 | 45 | 1000 | 40 | 2000 | 45 | 1000 |
Carrier | TUBE | LARGE T&R | TUBE | LARGE T&R | TUBE | LARGE T&R | TUBE | LARGE T&R |
Device Marking | ISO7842 | ISO7842 | ISO7842 | ISO7842 | ISO7842F | ISO7842F | ISO7842F | ISO7842F |
Width (mm) | 7.5 | 7.5 | 14 | 14 | 7.5 | 7.5 | 14 | 14 |
Length (mm) | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 | 10.3 |
Thickness (mm) | 2.35 | 2.35 | 2.45 | 2.45 | 2.35 | 2.35 | 2.45 | 2.45 |
Pitch (mm) | 1.27 | 1.27 | 1.27 | 1.27 | ||||
Max Height (mm) | 2.65 | 2.65 | 2.65 | 2.65 | ||||
Mechanical Data | Download | Download | Download | Download | Download | Download | Download | Download |
Parametrics
Parameters / Models | ISO7842DW | ISO7842DWR | ISO7842DWW | ISO7842DWWR | ISO7842FDW | ISO7842FDWR | ISO7842FDWW | ISO7842FDWWR |
---|---|---|---|---|---|---|---|---|
Data Rate(Max), Mbps | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Default Output | High | High | High | High | Low | Low | Low | Low |
Forward/Reverse Channels | 2/2 | 2/2 | 2/2 | 2/2 | 2/2 | 2/2 | 2/2 | 2/2 |
Integrated Isolated Power | No | No | No | No | No | No | No | No |
Isolation Rating, Vrms | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 | 5700 |
Number of Channels | 4 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Operating Temperature Range, C | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 |
Package Group | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
Package Size: mm2:W x L, PKG | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) | 16SOIC: 106 mm2: 10.3 x 10.3(SOIC) |
Propagation Delay, ns | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 |
Propagation Delay(Typ), ns | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 | 10.7 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
Surge Voltage Rating, Vpk | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 | 8000 |
VCC(Max), V | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 | 5.5 |
VCC(Min), V | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 | 2.25 |
Eco Plan
ISO7842DW | ISO7842DWR | ISO7842DWW | ISO7842DWWR | ISO7842FDW | ISO7842FDWR | ISO7842FDWW | ISO7842FDWWR | |
---|---|---|---|---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Application Notes
- Pushing the envelope with high-performance digital-isolation technologyPDF, 147 Kb, File published: Oct 30, 2015
- 4Q 2015 Analog Applications JournalPDF, 1.6 Mb, File published: Oct 30, 2015
- Shelf-Life Evaluation of Lead-Free Component FinishesPDF, 1.3 Mb, File published: May 24, 2004
The integrated circuit (IC) industry is converting to lead (Pb)-free termination finishes for leadframe-based packages. IC component users need to know the maximum length of time that components can be stored prior to being soldered. This study predicts shelf life of the primary Pb-free finishes being proposed by the industry. Components were exposed to a controlled environment, with known aging a - Isolation GlossaryPDF, 52 Kb, File published: Oct 27, 2014
- Digital Isolator Design Guide (Rev. A)PDF, 487 Kb, Revision: A, File published: Nov 4, 2014
Model Line
Series: ISO7842 (8)
Manufacturer's Classification
- Semiconductors> Isolation> Digital Isolators