Datasheet Texas Instruments LMR14206

ManufacturerTexas Instruments
SeriesLMR14206
Datasheet Texas Instruments LMR14206

SIMPLE SWITCHERВ® 4.5V to 42V, 0.6A Step-Down DC/DC Switching Regulator in SOT-23 Package

Datasheets

LMR14206 SIMPLE SWITCHER 42Vin, 0.6A Step-Dwn V-Reg in SOT-23 datasheet
PDF, 835 Kb, Revision: D, File published: Sep 30, 2015
Extract from the document

Prices

Status

LMR14206XMK/NOPBLMR14206XMKE/NOPBLMR14206XMKX/NOPB
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityYesYesYes

Packaging

LMR14206XMK/NOPBLMR14206XMKE/NOPBLMR14206XMKX/NOPB
N123
Pin666
Package TypeDDCDDCDDC
Industry STD TermSOT-23-THINSOT-23-THINSOT-23-THIN
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY10002503000
CarrierLARGE T&RSMALL T&RLARGE T&R
Device MarkingSJ2BSJ2BSJ2B
Width (mm)1.61.61.6
Length (mm)2.92.92.9
Thickness (mm).87.87.87
Pitch (mm).95.95.95
Max Height (mm)1.11.11.1
Mechanical DataDownloadDownloadDownload

Parametrics

Parameters / ModelsLMR14206XMK/NOPB
LMR14206XMK/NOPB
LMR14206XMKE/NOPB
LMR14206XMKE/NOPB
LMR14206XMKX/NOPB
LMR14206XMKX/NOPB
Control ModeCurrent ModeCurrent ModeCurrent Mode
Duty Cycle(Max), %878787
Iout(Max), A0.60.60.6
Iq(Typ), mA1.31.31.3
Operating Temperature Range, C-40 to 125-40 to 125-40 to 125
Package GroupSOT-23-THINSOT-23-THINSOT-23-THIN
RatingCatalogCatalogCatalog
Regulated Outputs111
Special FeaturesEnableEnableEnable
Switching Frequency(Max), kHz150015001500
Switching Frequency(Min), kHz950950950
TypeConverterConverterConverter
Vin(Max), V424242
Vin(Min), V4.54.54.5
Vout(Max), V343434
Vout(Min), V0.7650.7650.765

Eco Plan

LMR14206XMK/NOPBLMR14206XMKE/NOPBLMR14206XMKX/NOPB
RoHSCompliantCompliantCompliant

Application Notes

  • AN-643 EMI/RFI Board Design (Rev. B)
    PDF, 742 Kb, Revision: B, File published: May 3, 2004
    Application Note 643 EMI/RFI Board Design
  • Input and Output Capacitor Selection
    PDF, 219 Kb, File published: Sep 19, 2005
  • AN-1197 Selecting Inductors for Buck Converters (Rev. B)
    PDF, 558 Kb, Revision: B, File published: Apr 23, 2013
    This application report provides design information to help select an off-the-shelf inductor for anycontinuous-mode buck converter application.
  • AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
    PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
    This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
  • AN-1566 Techniques for Thermal Analysis of Switching Power Supply Designs (Rev. A)
    PDF, 1.4 Mb, Revision: A, File published: Apr 23, 2013
    This application note provides thermal power analysis techniques for analyzing the power IC.
  • AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
    PDF, 2.7 Mb, Revision: A, File published: Apr 23, 2013
    This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
  • Semiconductor and IC Package Thermal Metrics (Rev. C)
    PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
  • Low EMI Layout Made SIMPLE With LM43600/1/2/3 and LM46000/1/2 (Rev. A)
    PDF, 512 Kb, Revision: A, File published: Sep 12, 2014
    Printed Circuit Board (PCB) layout for Switched Mode Power Supplies (SMPS) is critical to achieve proper converter operation good thermal performance and excellent radiated EMI performance. Optimized board layout for low radiated EMI is made very simple by the package and pin arrangement of the SIMPLE SWITCHER Synchronous Buck Converter family LM4360x and LM4600x
  • AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
    PDF, 82 Kb, Revision: C, File published: Apr 23, 2013
    When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
  • AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
    PDF, 374 Kb, Revision: C, File published: Apr 23, 2013
    This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
  • Designing Low Cost Flyback Power Supply Using Boost Converter (TPS61165) for HF
    PDF, 4.2 Mb, File published: Apr 17, 2014
    TPS61165, LMR14206, TPS5401, AMC1100, TLV1117I-33, TLV1117I-50 Designing low cost flyback supply using boost converter for HF Inverter
  • AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
    PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
    Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
  • AN-1246 Stresses in Wide Input DC-DC Converters (Rev. C)
    PDF, 427 Kb, Revision: C, File published: Apr 23, 2013
    This application note discusses stresses in wide input DC-DC converters.
  • AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
    PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
    This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP

Model Line

Manufacturer's Classification

  • Semiconductors> Power Management> Non-isolated DC/DC Switching Regulator> Step-Down (Buck)> Buck Converter (Integrated Switch)