Datasheet Texas Instruments LMZ10501

Manufacturer	Texas Instruments
Series	LMZ10501

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	LMZ10501SILR	LMZ10501SILT
Iout(Max), A	1	1
Iq(Typ), mA	6.5	6.5
Operating Temperature Range, C	-40 to 125	-40 to 125
Package Type	MicroSiP (LGA)	MicroSiP (LGA)
Regulated Outputs	1	1
Soft Start	Fixed	Fixed
Special Features	EMI Tested,Enable	EMI Tested,Enable
Switching Frequency(Max), kHz	2250	2250
Switching Frequency(Min), kHz	1750	1750
Switching Frequency(Typ), kHz	2000	2000
Vin(Max), V	5.5	5.5
Vin(Min), V	2.7	2.7
Vout(Max), V	3.6	3.6
Vout(Min), V	0.6	0.6

Eco Plan

Application Notes

• Download
  AN-1412 Micro SMDxt Wafer Level Chip Scale Package (Rev. K)
  PDF, 6.3 Mb, Revision: K, File published: Apr 23, 2013
  Micro SMDxt is a wafer level CSP (WLCSP) with the following features:Package size equal to die sizeSmallest footprint per I/O countNo need for underfill materialInterconnect layout available in 0.4 mm or 0.5 mm pitchNo interposer between the silicon IC and the printed circuit board
• Download
  AN-2168 LMZ10501 and LMZ10500 SIMPLE SWITCHER Nano Module EMI Performance (Rev. A)
  PDF, 403 Kb, Revision: A, File published: Apr 23, 2013
  The LMZ10501 and LMZ10500 nano modules offer excellent EMI performance. The evaluation board withthe default components complies with the CISPR 22 Class B radiated emissions standard. Adding twosmall 0.1ОјF 0805 input capacitors results in CISPR 25 Class 5 radiated emissions standard compliance.The addition of a small LC filter (1ОјH and 1ОјF) to the input of the default evaluation board result
• Download
  AN-2169 LMZ10501 and LMZ10500 SIMPLE SWITCHER Nano Module (Rev. A)
  PDF, 298 Kb, Revision: A, File published: Apr 23, 2013
  The LMZ10501 and LMZ10500 SIMPLE SWITCHER nano modules are easy-to-use DC-DC solutionsoptimized for space-constrained applications. The LMZ10501 is capable of driving up to 1A load withexcellent power conversion efficiency, line and load regulation. The LMZ10500 is a 650mA version moduleand is pin-to-pin compatible with the LMZ10501.
• Download
  Industrial-strength design considerations to prevent thermal and EMI damage
  PDF, 282 Kb, File published: Apr 11, 2014
• Download
  AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)
  PDF, 13.7 Mb, Revision: AG, File published: Aug 12, 2015
• Download
  Understanding and Applying Current-Mode Control Theory
  PDF, 409 Kb, File published: Aug 19, 2007
• Download
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, Revision: A, File published: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
• Download
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, Revision: C, File published: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• Download
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, Revision: B, File published: May 3, 2004
  Application Note 643 EMI/RFI Board Design
• Download
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Download
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
• Download
  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, Revision: C, File published: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• Download
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Download
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
• Download
  Input and Output Capacitor Selection
  PDF, 219 Kb, File published: Sep 19, 2005

Model Line

Manufacturer's Classification

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module