Datasheet Texas Instruments LMZ31506

Manufacturer	Texas Instruments
Series	LMZ31506

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	LMZ31506RUQR	LMZ31506RUQT
Iout(Max), A	6	6
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Size: mm2:W x L, PKG	47B1QFN: 135 mm2: 9 x 15(B1QFN)	47B1QFN: 135 mm2: 9 x 15(B1QFN)
Package Type	QFN	QFN
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	Current Sharing,EMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking	Current Sharing,EMI Tested,Enable,Frequency Synchronization,Power Good,Remote Sense,Tracking
Switching Frequency(Max), kHz	780	780
Switching Frequency(Min), kHz	250	250
Switching Frequency(Typ), kHz	500	500
Vin(Max), V	14.5	14.5
Vin(Min), V	2.95	2.95
Vout(Max), V	5.5	5.5
Vout(Min), V	0.6	0.6

Eco Plan

Application Notes

• Download
  LMZ31506 Parallel Operation
  PDF, 315 Kb, File published: Jul 2, 2013
  The LMZ31506 is a 2.95-V to 14.5-V input, 6-A output, integrated power solution which integrates the PWM controller, power MOSFETs, inductor and passives in a low-profile, QFN package. For applications requiring greater than 6 A, it is possible to parallel two or more LMZ31506 devices by following the recommendations in this paper.
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  Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V
  PDF, 38 Kb, File published: Jul 2, 2013
  LMZ31503 Powering LMZ3 SIMPLE SWITCHERВ® Power Modules from 3.3V
• Download
  Adjusting LMZ3 Output Voltage with LM10010/1
  PDF, 87 Kb, File published: Feb 11, 2014
  ThisapplicationnoteoutlinesthemethodstopairanLMZ3powermodulewithanLM10010/1VIDvoltageprogrammertoadjusttheoutputvoltage.TheLMZ3powermoduleisaneasy-to-useintegratedpowersolutionwhichcombinesaDC/DCconverterwithpowerMOSFETs,ashieldedinductor,andpassivecomponentsintoalowprofileQFNpackage,whilest
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  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Mb, Revision: A, File published: Jun 8, 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
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  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Kb, Revision: B, File published: Jun 8, 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
• Download
  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Kb, File published: Nov 22, 2013
• Download
  Understanding and Applying Current-Mode Control Theory
  PDF, 409 Kb, File published: Aug 19, 2007
• Download
  AN-643 EMI/RFI Board Design (Rev. B)
  PDF, 742 Kb, Revision: B, File published: May 3, 2004
  Application Note 643 EMI/RFI Board Design
• Download
  AN-1149 Layout Guidelines for Switching Power Supplies (Rev. C)
  PDF, 82 Kb, Revision: C, File published: Apr 23, 2013
  When designing a high frequency switching regulated power supply layout is very important. Using agood layout can solve many problems associated with these types of supplies. The problems due to a badlayout are often seen at high current levels and are usually more obvious at large input to output voltagedifferentials. Some of the main problems are loss of regulation at high output current
• Download
  AN-1889 How to Measure the Loop Transfer Function of Power Supplies (Rev. A)
  PDF, 2.7 Mb, Revision: A, File published: Apr 23, 2013
  This application report shows how to measure the critical points of a bode plot with only an audiogenerator (or simple signal generator) and an oscilloscope. The method is explained in an easy to followstep-by-step manner so that a power supply designer can start performing these measurements in a shortamount of time.
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  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-1229 SIMPLE SWITCHER PCB Layout Guidelines (Rev. C)
  PDF, 374 Kb, Revision: C, File published: Apr 23, 2013
  This application report provides SIMPLE SWITCHER™ PCB layout guidelines.
• Download
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
• Download
  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
• Download
  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, Revision: B, File published: Aug 24, 2018
• Download
  Input and Output Capacitor Selection
  PDF, 219 Kb, File published: Sep 19, 2005

Model Line

Manufacturer's Classification

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module