Datasheet Texas Instruments LMZ31710

Manufacturer	Texas Instruments
Series	LMZ31710

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	LMZ31710RVQR	LMZ31710RVQT
Iout(Max), A	10	10
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Size: mm2:W x L, PKG	42B3QFN: 100 mm2: 10 x 10(B3QFN)	42B3QFN: 100 mm2: 10 x 10(B3QFN)
Package Type	QFN	QFN
Regulated Outputs	1	1
Soft Start	Adjustable	Adjustable
Special Features	Current Sharing,EMI Tested,Frequency Synchronization,Power Good,Remote Sense,Tracking,Light Load Efficiency	Current Sharing,EMI Tested,Frequency Synchronization,Power Good,Remote Sense,Tracking,Light Load Efficiency
Switching Frequency(Max), kHz	1200	1200
Switching Frequency(Min), kHz	200	200
Switching Frequency(Typ), kHz	1000	1000
Vin(Max), V	17	17
Vin(Min), V	2.95	2.95
Vout(Max), V	5.5	5.5
Vout(Min), V	0.6	0.6

Eco Plan

Application Notes

• Download
  Using LMZ31710 for Higher Output Voltages
  PDF, 95 Kb, File published: Nov 9, 2015
  The LMZ31710 power module has been designed and characterized for operation at output voltages from0.6 V to 5.5 V. However, several applications require higher voltages than the standard point-of-loadvoltages that the LMZ31710 is designed for. Following the guidance in this application note, theLMZ31710 can be used for output voltages up to 9.5 V. All data included in this application note h
• Download
  LMZ31710, LMZ31707, LMZ31704 Parallel
  PDF, 217 Kb, File published: Jul 2, 2013
  The LMZ31710 is a 2.95-V to 17-V input, 10-A output, integrated power solution which integrates the PWM controller, power MOSFETs, inductor and passives in a low-profile, QFN package. For applications requiring greater than 10 A, it is possible to parallel up to six LMZ31710 devices by following the recommendations in this paper.
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  Power Module MSL Ratings
  PDF, 137 Kb, File published: Jan 20, 2017
  All semiconductor devices, including power modules that have a moisture sensitivity level (MSL) rating and a peak reflow classification, which provides needed information when manufacturing with the device. This application report helps to explain these ratings.
• Download
  Powering LMZ3 SIMPLE SWITCHER Power Modules From 3.3 V
  PDF, 38 Kb, File published: Jul 2, 2013
  LMZ31503 Powering LMZ3 SIMPLE SWITCHERВ® Power Modules from 3.3V
• Download
  Adjusting LMZ3 Output Voltage with LM10010/1
  PDF, 87 Kb, File published: Feb 11, 2014
  ThisapplicationnoteoutlinesthemethodstopairanLMZ3powermodulewithanLM10010/1VIDvoltageprogrammertoadjusttheoutputvoltage.TheLMZ3powermoduleisaneasy-to-useintegratedpowersolutionwhichcombinesaDC/DCconverterwithpowerMOSFETs,ashieldedinductor,andpassivecomponentsintoalowprofileQFNpackage,whilest
• Download
  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Mb, Revision: A, File published: Jun 8, 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
• Download
  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Kb, Revision: B, File published: Jun 8, 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
• Download
  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Kb, File published: Nov 22, 2013
• Download
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
• Download
  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
• Download
  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
• Download
  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, Revision: B, File published: Aug 24, 2018
• Download
  Input and Output Capacitor Selection
  PDF, 219 Kb, File published: Sep 19, 2005

Model Line

Manufacturer's Classification

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Step-Down (Buck) Module