Datasheet Texas Instruments LMZ34002

Manufacturer	Texas Instruments
Series	LMZ34002

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	LMZ34002RKGR	LMZ34002RKGT
Iout(Max), A	2	2
Operating Temperature Range, C	-40 to 85	-40 to 85
Package Size: mm2:W x L, PKG	41B1QFN: 99 mm2: 9 x 11(B1QFN)	41B1QFN: 99 mm2: 9 x 11(B1QFN)
Package Type	QFN	QFN
Special Features	EMI Tested,Negative Output,Remote Sense	EMI Tested,Negative Output,Remote Sense
Topology	Inverting	Inverting
Vin(Max), V	40	40
Vin(Min), V	4.5	4.5
Vout(Max), V	-17	-17
Vout(Min), V	-3	-3

Eco Plan

Application Notes

• Download
  Reducing Output Ripple and Noise using the LMZ34002
  PDF, 443 Kb, File published: Sep 10, 2013
  IntroductionManyindustrialapplicationsrequirebothpositiveandnegativevoltagestopowertheiranalogcircuitry.Manyoftheseanalogcircuitssuchasdataconverters,audioamplifiers,sensors,andRFapplicationsrequirelownoiseandripple.TheLMZ34002isanegativeoutputvoltagepowermodulewhichcanprovidethenegativeoutputvoltag
• Download
  Working With QFN Power Modules (Rev. A)
  PDF, 1.7 Mb, Revision: A, File published: Jun 8, 2017
  TexasInstrumentsQuadFlatpackNo-lead(QFN)powermodulesallowfor boardminiaturization,and holdseveraladvantagesoverotherpowermodulepackages.The QFNpackageshavehigherpowerdensity,asmallerroutingarea,improvedthermalperformance,and improvedelectricalparasitics.Additionally,theabsenceof externalleadseliminatesbent-leadconc
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  Soldering Requirements for BQFN Packages (Rev. B)
  PDF, 737 Kb, Revision: B, File published: Jun 8, 2017
  This documentoutlinesthe solderingrequirementsfor the TPS84and LMZ3devicefamilies
• Download
  Uninterruptible Synchronization Clock Circuit
  PDF, 74 Kb, File published: Nov 22, 2013
• Download
  AN-1520 A Guide to Board Layout for Best Thermal Resistance for Exposed Packages (Rev. B)
  PDF, 9.2 Mb, Revision: B, File published: Apr 23, 2013
  This thermal application report provides guidelines for the optimal board layout to achieve the best thermalresistance for exposed packages. The thermal resistance between junction-to-ambient (ОёJA) is highlydependent on the PCB (Printed Circuit Board) design factors. This becomes more critical for packageshaving very low thermal resistance between junction-to-case such as exposed pad TSSOP
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  AN-2155 Layout Tips for EMI Reduction in DC/ DC Converters (Rev. A)
  PDF, 3.6 Mb, Revision: A, File published: Apr 23, 2013
  This application note will explore how the layout of your DC/DC power supply can significantly affect theamount of EMI that it produces. It will discuss several variations of a layout analyze the results andprovide answers to some common EMI questions such whether or not to use a shielded inductor.
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  AN-2162 Simple Success With Conducted EMI From DC-DC Converters (Rev. C)
  PDF, 2.5 Mb, Revision: C, File published: Apr 24, 2013
  Electromagnetic Interference (EMI) is an unwanted effect between two electrical systems as a result ofeither electromagnetic radiation or electromagnetic conduction. EMI is the major adverse effect caused bythe application of switch-mode power supplies (SMPS). In switching power supplies EMI noise isunavoidable due to the switching actions of the semiconductor devices and resulting disconti
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  Semiconductor and IC Package Thermal Metrics (Rev. C)
  PDF, 201 Kb, Revision: C, File published: Apr 19, 2016
• Download
  QFN and SON PCB Attachment (Rev. B)
  PDF, 821 Kb, Revision: B, File published: Aug 24, 2018
• Download
  Input and Output Capacitor Selection
  PDF, 219 Kb, File published: Sep 19, 2005

Model Line

Manufacturer's Classification

• Semiconductors> Power Management> Power Modules> Non-Isolated Module> Buck/Boost & Negative Output Module