Datasheet Texas Instruments MSP430F2101
Manufacturer | Texas Instruments |
Series | MSP430F2101 |
16-bit Ultra-Low-Power Microcontroller, 1kB Flash, 128B RAM, Comparator
Datasheets
MSP430x21x1 Mixed Signal Microcontroller datasheet
PDF, 1.7 Mb, Revision: F, File published: Aug 2, 2011
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Status
MSP430F2101IDGV | MSP430F2101IDGVR | MSP430F2101IDW | MSP430F2101IDWR | MSP430F2101IPW | MSP430F2101IPWR | MSP430F2101IRGER | MSP430F2101IRGET | MSP430F2101TDGV | MSP430F2101TDGVR | MSP430F2101TDW | MSP430F2101TDWR | MSP430F2101TPW | MSP430F2101TPWR | MSP430F2101TRGER | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
Manufacture's Sample Availability | Yes | Yes | No | No | Yes | No | No | No | No | Yes | No | Yes | No | Yes | Yes |
Packaging
MSP430F2101IDGV | MSP430F2101IDGVR | MSP430F2101IDW | MSP430F2101IDWR | MSP430F2101IPW | MSP430F2101IPWR | MSP430F2101IRGER | MSP430F2101IRGET | MSP430F2101TDGV | MSP430F2101TDGVR | MSP430F2101TDW | MSP430F2101TDWR | MSP430F2101TPW | MSP430F2101TPWR | MSP430F2101TRGER | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
N | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |
Pin | 20 | 20 | 20 | 20 | 20 | 20 | 24 | 24 | 20 | 20 | 20 | 20 | 20 | 20 | 24 |
Package Type | DGV | DGV | DW | DW | PW | PW | RGE | RGE | DGV | DGV | DW | DW | PW | PW | RGE |
Industry STD Term | TVSOP | TVSOP | SOIC | SOIC | TSSOP | TSSOP | VQFN | VQFN | TVSOP | TVSOP | SOIC | SOIC | TSSOP | TSSOP | VQFN |
JEDEC Code | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | S-PQFP-N | S-PQFP-N | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | R-PDSO-G | S-PQFP-N |
Package QTY | 90 | 2000 | 25 | 2000 | 70 | 2000 | 3000 | 250 | 90 | 2000 | 25 | 2000 | 70 | 2000 | 3000 |
Carrier | TUBE | LARGE T&R | TUBE | LARGE T&R | TUBE | LARGE T&R | LARGE T&R | SMALL T&R | TUBE | LARGE T&R | TUBE | LARGE T&R | TUBE | LARGE T&R | LARGE T&R |
Device Marking | 4F2101 | 4F2101 | M430F2101 | M430F2101 | 430F2101 | 430F2101 | M430F | 2101 | 4F2101T | 4F2101T | M430F2101T | M430F2101T | 4F2101T | 4F2101T | 2101T |
Width (mm) | 4.4 | 4.4 | 7.5 | 7.5 | 4.4 | 4.4 | 4 | 4 | 4.4 | 4.4 | 7.5 | 7.5 | 4.4 | 4.4 | 4 |
Length (mm) | 5 | 5 | 12.8 | 12.8 | 6.5 | 6.5 | 4 | 4 | 5 | 5 | 12.8 | 12.8 | 6.5 | 6.5 | 4 |
Thickness (mm) | 1.05 | 1.05 | 2.35 | 2.35 | 1 | 1 | .88 | .88 | 1.05 | 1.05 | 2.35 | 2.35 | 1 | 1 | .88 |
Pitch (mm) | .4 | .4 | 1.27 | 1.27 | .65 | .65 | .5 | .5 | .4 | .4 | 1.27 | 1.27 | .65 | .65 | .5 |
Max Height (mm) | 1.2 | 1.2 | 2.65 | 2.65 | 1.2 | 1.2 | 1 | 1 | 1.2 | 1.2 | 2.65 | 2.65 | 1.2 | 1.2 | 1 |
Mechanical Data | Download | Download | Download | Download | Download | Download | Download | Download | Download | Download | Download | Download | Download | Download | Download |
Parametrics
Parameters / Models | MSP430F2101IDGV | MSP430F2101IDGVR | MSP430F2101IDW | MSP430F2101IDWR | MSP430F2101IPW | MSP430F2101IPWR | MSP430F2101IRGER | MSP430F2101IRGET | MSP430F2101TDGV | MSP430F2101TDGVR | MSP430F2101TDW | MSP430F2101TDWR | MSP430F2101TPW | MSP430F2101TPWR | MSP430F2101TRGER |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
ADC | Slope | Slope | Slope | Slope | Slope | Slope | Slope | Slope | Slope | Slope | Slope | Slope | Slope | Slope | Slope |
AES | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
Active Power, uA/MHz | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 | 250 |
Additional Features | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset | Watchdog,Brown Out Reset |
BSL | UART | UART | UART | UART | UART | UART | UART | UART | UART | UART | UART | UART | UART | UART | UART |
CPU | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 | MSP430 |
Comparators | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
Frequency, MHz | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
GPIO Pins | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
Max VCC | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 | 3.6 |
Min VCC | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 | 1.8 |
Multiplier | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
Non-volatile Memory, KB | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Operating Temperature Range, C | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 | -40 to 85,-40 to 105 |
Package Group | TVSOP | TVSOP | SOIC | SOIC | TSSOP | TSSOP | VQFN | VQFN | TVSOP | TVSOP | SOIC | SOIC | TSSOP | TSSOP | VQFN |
Package Size: mm2:W x L, PKG | 20TVSOP: 32 mm2: 6.4 x 5(TVSOP) | 20TVSOP: 32 mm2: 6.4 x 5(TVSOP) | 20SOIC: 132 mm2: 10.3 x 12.8(SOIC) | 20SOIC: 132 mm2: 10.3 x 12.8(SOIC) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 24VQFN: 16 mm2: 4 x 4(VQFN) | 24VQFN: 16 mm2: 4 x 4(VQFN) | 20TVSOP: 32 mm2: 6.4 x 5(TVSOP) | 20TVSOP: 32 mm2: 6.4 x 5(TVSOP) | 20SOIC: 132 mm2: 10.3 x 12.8(SOIC) | 20SOIC: 132 mm2: 10.3 x 12.8(SOIC) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP) | 24VQFN: 16 mm2: 4 x 4(VQFN) |
RAM, KB | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 | 0.125 |
Rating | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog | Catalog |
Special I/O | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A | N/A |
Standby Power, LPM3-uA | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 | 0.7 |
Timers - 16-bit | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Wakeup Time, us | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Eco Plan
MSP430F2101IDGV | MSP430F2101IDGVR | MSP430F2101IDW | MSP430F2101IDWR | MSP430F2101IPW | MSP430F2101IPWR | MSP430F2101IRGER | MSP430F2101IRGET | MSP430F2101TDGV | MSP430F2101TDGVR | MSP430F2101TDW | MSP430F2101TDWR | MSP430F2101TPW | MSP430F2101TPWR | MSP430F2101TRGER | |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
RoHS | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant | Compliant |
Application Notes
- Migrating from the MSP430F2xx Family to the MSP430FR57xx Family (Rev. A)PDF, 154 Kb, Revision: A, File published: Feb 16, 2012
This application report enables easy migration from MSP430F2xx Flash-based MCUs to the MSP430FR57xx family FRAM-based MCU. It covers programming, system, and peripheral considerations when migrating firmware. The purpose is to highlight differences between the two families. For more information on the usage of the MSP430FR57xx features, see the MSP430FR57xx Family User's Guide (Migrating from the USCI Module to the eUSCI Module (Rev. A)PDF, 41 Kb, Revision: A, File published: Sep 13, 2012
The purpose of this application report is to enable easy migration for designs based on the USCI_A and USCI_B modules to the eUSCI_A and the eUSCI_B modules. The document highlights the new features in the eUSCI module and the main differences between the USCI and the eUSCI modules.Migrating From MSP430 F2xx and G2xx Families to MSP430 FR4xx and FR2xx Family (Rev. E)PDF, 237 Kb, Revision: E, File published: May 4, 2018
This application report helps to ease the migration from MSP430F2xx flash-based MCUs to the MSP430FR4xx and MSP430FR2xx family of FRAM-based MCUs. It discusses programming system hardware core architecture and peripheral considerations. The intent is to highlight key differences between the two families. For more information on the use of the MSP430FR4xx and MSP430FR2xx devices see the MSP430Migrating from the MSP430F2xx,G2xx Family to the MSP430FR58xx/FR59xx/68xx/69xx (Rev. E)PDF, 179 Kb, Revision: E, File published: Nov 3, 2016
This application report enables easy migration from MSP430F2xx flash-based MCUs to the MSP430FR58xx/FR59xx/68xx/69xx family of FRAM-based MCUs. For the migration guide to MSP430FR57xx, see Migrating From the MSP430F2xx Family to the MSP430FR57xx Family. It covers programming, system, and peripheral considerations when migrating firmware. The intent is to highlight key differences between the two fCurrent Transformer Phase Shift Compensation and CalibrationPDF, 63 Kb, File published: Jan 30, 2001
This application report demonstrates a digital technique to compensate and calibrate the phase shift of a current (or voltage) transformer used in electric power of energy measurement. Traditional analog compensation is replaced by a digital finite impulse response (FIR) filter. A technique emulating a non-unity power factor (non-UPF) load makes the calibration fully automatic. The calibration timMSP430 Isolated FET InterfacePDF, 1.2 Mb, File published: Oct 10, 2003
This application report describes how to build an isolated FET interface for the MSP430 Flash Emulation Tool (FET). When developing and debugging line-powered MSP430applications such as motor control, electricity energy meters, power monitoring systems etc. it is important to have electrical isolation for the development tool such that the personnel involved and the connected electronic equipmenSpread-Spectrum Clock Source Using an MSP430PDF, 228 Kb, File published: May 31, 2006
While spread-spectrum clocking has long since been used in processor and memory clock trees, there are many other clocked systems, such as power supplies or switch-mode amplifiers, that continue to use a single-frequency clock. This can, in turn, generate significant EMI and can make meeting governmental regulations for EMI challenging. These regulations typically set a limit on peak energy withinHDQ Protocol Implementation with MSP430PDF, 124 Kb, File published: Feb 19, 2004Generation and Recognition of DTMF Signals With the Microcontroller MSP430PDF, 233 Kb, File published: Oct 1, 1997
The first part of the Application Report describes the generation of DTMF signals using the Microcontroller MSP430. Following an explanation of the most important specifications which are involved, the theoretical and mathematical processes will be discussed with which sinusoidal waveforms can be derived from square-wave signals, by making use of appropriate analog filters. Tested examples of softEconomic Voltage Measurement With the MSP430 FamilyPDF, 91 Kb, File published: Oct 12, 1999
This application report describes voltage and current measurement methods using the MSP430 universal timer/port module. The report explains the two measurement methods (charge and discharge) and shows how to measure voltage and current. The equations for the calculations are also given. Further sections show additional applications such as the measurement of two voltage inputs, bridge arrangemMSP430 LFXT1 Oscillator AccuracyPDF, 184 Kb, File published: Nov 15, 2004
This report details the factors that influence achievable accuracy of the low frequency oscillator, specifically for real-time clock (RTC) applications. The intent of this application report is to provide an understanding of MSP430-specific factors influencing real-world achievable RTC accuracy using the LFXT1 oscillator with a standard 32.768 kHz watch crystal and present measurement data supportChoosing an Ultra Low-Power MCUPDF, 306 Kb, File published: Jun 30, 2004
This application report describes how to compare ultralow-power MCUs. It discusses the key differences between popular low-power MCUs and how to interpret features and specifications and apply them to application requirements.MSP430 Family Mixed-Signal Microcontroller Application ReportsPDF, 5.5 Mb, File published: Jan 21, 2000
MSP430 Metering Application ReportSimple 1.5 V Boost Converter for MSP430PDF, 49 Kb, File published: Oct 18, 2000
A simple, efficient, low-cost, boost converter to take 1.5 V from a single type-AA alkaline battery to the operating voltage required by the MSP430 family of ultralow-power microcontrollers is described. Expected battery life is up to 1000 hours.Wave Digital Filtering Using the MSP430PDF, 220 Kb, File published: Sep 13, 2006
Digital filtering is an integral part of many digital signal processing algorithms. Digital filters are characterized as either recursive [infinite impulse response (IIR)] or non-recursive [finite impulse response (FIR)] filters. IIR filters require a smaller order for the same set of specifications compared to FIR filters, while FIR filters provide a linear phase property. However, IIR filters, iFSK Modulation and Demodulation With the Microcontroller MSP430PDF, 110 Kb, File published: Dec 14, 1998
This application report describes a software program for performing V.23 FSK modem transceiver functions using an MSP430 microcontroller. It makes use of novel filter architecture to perform DSP functions on a processor with only shift and add capabilities.Mixing C and Assembler with the MSP430PDF, 168 Kb, File published: Feb 28, 2002
This application note describes how C and assembler code can be used together within an MSP430 application. The combination of C and assembler benefits the designer by providing the power of a high-level language as well as the speed, efficiency, and low-level control of assembler.CRC Implementation with MSP430PDF, 125 Kb, File published: Nov 4, 2004
Cyclic Redundancy Code (CRC) is commonly used to determine the correctness of a data transmission or storage. This application note presents a solution to compute 16-bit and 32-bit CRCs on the ultra low-power TI MSP430 microcontroller for the bitwise algorithm (low memory, low cost) and the table-based algorithm (low MIPS, low power). Both algorithms are presented in C and MSP430 assembly. Test coRandom Number Generation Using the MSP430PDF, 39 Kb, File published: Oct 13, 2006
Many applications require the generation of random numbers. These random numbers are useful for applications such as communication protocols, cryptography, and device individualization.Generating random numbers often requires the use of expensive dedicated hardware. Using the two independent clocks available on the MSP430F2xx family of devices, it is possible to generate random numbers without sEfficient Multiplication and Division Using MSP430PDF, 104 Kb, File published: Aug 3, 2006Interfacing the MSP430 and TLC549/1549 A/D ConvertersPDF, 44 Kb, File published: Nov 16, 2000
This application report describes how to interface an MSP430 mixed-signal microcontroller with the TLC549 and TLV1549 3-volt A/D converters. This report is written for the MSP430x11x(1) family, but can be adapted to any MSP430 derivative.Interfacing TMS320C5000 DSP to MSP430 Mixed Signal Microcontroller (Rev. A)PDF, 82 Kb, Revision: A, File published: Oct 13, 2000
The TMS320C5000в„ў family of digital signal processors (DSPs) features Host Port Interface Controllers (HPI) and Direct Memory Access Controllers (DMAC) for efficient data movement without any CPU involvement. The HPI enables the DSP to interface to host processors (typically microcontrollers) bidirectionally with minimal or no external interface logic. This application report presents a hardwMSP430 Capacitive Single-Touch Sensor Design GuidePDF, 770 Kb, File published: Jan 16, 2008
This application report discusses the design of RC-type capacitive single-touch sensors using the MSP430 microcontroller. The MSP430 has some unique features that make it suitable for interfacing with capacitive-touch sensors. The RC-type method does not need special peripherals and can be implemented with all devices in the MSP430 product family. This method is also inherently low power and canProgramming a Flash-Based MSP430 Using the JTAG Interface (Rev. H)