Datasheet Texas Instruments PT3301C
| Manufacturer | Texas Instruments |
| Series | PT3301 |
| Part Number | PT3301C |
Datasheets
Prices
Status
| Lifecycle Status | NRND (Not recommended for new designs) |
| Manufacture's Sample Availability | No |
Packaging
| Pin | 19 |
| Package Type | EHJ |
| Industry STD Term | SIP MODULE |
| JEDEC Code | R-MSIP-G |
| Width (mm) | 32.5 |
| Length (mm) | 71.37 |
| Thickness (mm) | 12.45 |
| Pitch (mm) | 2.54 |
| Max Height (mm) | 12.95 |
| Mechanical Data | Download |
Eco Plan
| RoHS | Not Compliant |
| Pb Free | No |
Application Notes
- Reflow Soldering Requirements for Plug-In Power Suface-Mount ProductsPDF, 44 Kb, File published: Aug 1, 2000
Describes the soldering requirements for the surface mount versions of all Plug-in Power products, and gives guidelines for the development of a suitable reflow profile. - ISR Input/Output Filters (Rev. A)PDF, 81 Kb, Revision: A, File published: Aug 3, 2000
- EMI Considerations for DC to DC Converters and Integrated Switching Regulators (Rev. A)PDF, 38 Kb, Revision: A, File published: Aug 3, 2000
- ISR Qualification Process (Rev. A)PDF, 50 Kb, Revision: A, File published: Aug 3, 2000
Model Line
Manufacturer's Classification
- Semiconductors > Power Management > Power Modules > Non-Isolated Module > Step-Down (Buck) Module
