Datasheet Texas Instruments SN54ACT8997
| Manufacturer | Texas Instruments |
| Series | SN54ACT8997 |
Scan Path Linkers With 4-Bit Identification Buses
Datasheets
Scan Path Linkers With 4-Bit Identification Buses Scan-Controlled IEEE Std datasheet
PDF, 1.0 Mb, Revision: D, File published: Dec 1, 1996
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Status
| 5962-9323901Q3A | 5962-9323901QXA | SNJ54ACT8997FK | SNJ54ACT8997JT | |
|---|---|---|---|---|
| Lifecycle Status | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | No | No | No |
Packaging
| 5962-9323901Q3A | 5962-9323901QXA | SNJ54ACT8997FK | SNJ54ACT8997JT | |
|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 |
| Pin | 28 | 28 | 28 | 28 |
| Package Type | FK | JT | FK | JT |
| Industry STD Term | LCCC | CDIP | LCCC | CDIP |
| JEDEC Code | S-CQCC-N | R-GDIP-T | S-CQCC-N | R-GDIP-T |
| Package QTY | 1 | 1 | 1 | 1 |
| Carrier | TUBE | TUBE | TUBE | TUBE |
| Device Marking | 9323901Q3A | SNJ54ACT8997JT | 9323901Q3A | 5962-9323901QX |
| Width (mm) | 11.43 | 7.32 | 11.43 | 7.32 |
| Length (mm) | 11.43 | 36.83 | 11.43 | 36.83 |
| Thickness (mm) | 1.83 | 4.7 | 1.83 | 4.7 |
| Pitch (mm) | 1.27 | 2.54 | 1.27 | 2.54 |
| Max Height (mm) | 2.03 | 5.08 | 2.03 | 5.08 |
| Mechanical Data | Download | Download | Download | Download |
Parametrics
| Parameters / Models | 5962-9323901Q3A | 5962-9323901QXA | SNJ54ACT8997FK | SNJ54ACT8997JT |
|---|---|---|---|---|
| Input Type | TTL | TTL | TTL | TTL |
| Operating Temperature Range, C | -55 to 125 | -55 to 125 | -55 to 125 | -55 to 125 |
| Output Type | CMOS | CMOS | CMOS | CMOS |
| Package Group | LCCC | CDIP | LCCC | CDIP |
| Package Size: mm2:W x L, PKG | 28LCCC: 131 mm2: 11.43 x 11.43(LCCC) | See datasheet (CDIP) | 28LCCC: 131 mm2: 11.43 x 11.43(LCCC) | See datasheet (CDIP) |
| Rating | Military | Military | Military | Military |
| Technology Family | ACT | ACT | ACT | ACT |
| VCC(Max), V | 5.5 | 5.5 | 5.5 | 5.5 |
| VCC(Min), V | 4.5 | 4.5 | 4.5 | 4.5 |
Eco Plan
| 5962-9323901Q3A | 5962-9323901QXA | SNJ54ACT8997FK | SNJ54ACT8997JT | |
|---|---|---|---|---|
| RoHS | See ti.com | See ti.com | See ti.com | See ti.com |
Application Notes
- TI IBIS File Creation Validation and Distribution ProcessesPDF, 380 Kb, File published: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con - Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
- Semiconductor Packing Material Electrostatic Discharge (ESD) ProtectionPDF, 337 Kb, File published: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge - Selecting the Right Level Translation Solution (Rev. A)PDF, 313 Kb, Revision: A, File published: Jun 22, 2004
Supply voltages continue to migrate to lower nodes to support today's low-power high-performance applications. While some devices are capable of running at lower supply nodes others might not have this capability. To haveswitching compatibility between these devices the output of each driver must be compliant with the input of the receiver that it is driving. There are several level-translati - Designing With Logic (Rev. C)PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w - Introduction to LogicPDF, 93 Kb, File published: Apr 30, 2015
- Implications of Slow or Floating CMOS Inputs (Rev. D)PDF, 260 Kb, Revision: D, File published: Jun 23, 2016
- CMOS Power Consumption and CPD Calculation (Rev. B)PDF, 89 Kb, Revision: B, File published: Jun 1, 1997
Reduction of power consumption makes a device more reliable. The need for devices that consume a minimum amount of power was a major driving force behind the development of CMOS technologies. As a result CMOS devices are best known for low power consumption. However for minimizing the power requirements of a board or a system simply knowing that CMOS devices may use less power than equivale - Using High Speed CMOS and Advanced CMOS in Systems With Multiple VccPDF, 43 Kb, File published: Apr 1, 1996
Though low power consumption is a feature of CMOS devices sometimes this feature does not meet a designer?s system power supply constraints. Therefore a partial system power down or multiple Vcc supplies are used to meet the needs of the system. This document shows electrostatic discharge protection circuits. It also provides circuit and bus driver examples of partial system power down and curren
Model Line
Series: SN54ACT8997 (4)
Manufacturer's Classification
- Semiconductors> Space & High Reliability> Logic Products> Specialty Logic Products> Boundary Scan (JTAG)
