Datasheet Texas Instruments SN54F374

ManufacturerTexas Instruments
SeriesSN54F374
Datasheet Texas Instruments SN54F374

Octal Edge-Triggered D-type Flip-Flops With 3-State Outputs

Datasheets

Octal Edge-Triggered D-Type Flip-Flops With 3-State Outputs datasheet
PDF, 1.3 Mb, Revision: A, File published: Oct 1, 1993
Extract from the document

Prices

Status

5962-9759001Q2A5962-9759001QRA5962-9759001QSAJM38510/34105B2AJM38510/34105BRAJM38510/34105BSAM38510/34105B2AM38510/34105BRAM38510/34105BSASN54F374JSNJ54F374FKSNJ54F374JSNJ54F374W
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoNoNoNoNoNoNoNoNoNoNoNoNo

Packaging

5962-9759001Q2A5962-9759001QRA5962-9759001QSAJM38510/34105B2AJM38510/34105BRAJM38510/34105BSAM38510/34105B2AM38510/34105BRAM38510/34105BSASN54F374JSNJ54F374FKSNJ54F374JSNJ54F374W
N12345678910111213
Pin20202020202020202020202020
Package TypeFKJWFKJWFKJWJFKJW
Industry STD TermLCCCCDIPCFPLCCCCDIPCFPLCCCCDIPCFPCDIPLCCCCDIPCFP
JEDEC CodeS-CQCC-NR-GDIP-TR-GDFP-FS-CQCC-NR-GDIP-TR-GDFP-FS-CQCC-NR-GDIP-TR-GDFP-FR-GDIP-TS-CQCC-NR-GDIP-TR-GDFP-F
Package QTY1111111111111
CarrierTUBETUBETUBETUBETUBETUBETUBETUBETUBETUBETUBETUBETUBE
Device Marking5962-AAJM38510/JM38510/34105BSA34105B2AJM38510/JM38510/SN54F374J374FKSNJ54F374JSNJ54F374W
Width (mm)8.896.926.928.896.926.928.896.926.926.928.896.926.92
Length (mm)8.8924.213.098.8924.213.098.8924.213.0924.28.8924.213.09
Thickness (mm)1.834.571.841.834.571.841.834.571.844.571.834.571.84
Pitch (mm)1.272.541.271.272.541.271.272.541.272.541.272.541.27
Max Height (mm)2.035.082.452.035.082.452.035.082.455.082.035.082.45
Mechanical DataDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownloadDownload

Parametrics

Parameters / Models5962-9759001Q2A
5962-9759001Q2A
5962-9759001QRA
5962-9759001QRA
5962-9759001QSA
5962-9759001QSA
JM38510/34105B2A
JM38510/34105B2A
JM38510/34105BRA
JM38510/34105BRA
JM38510/34105BSA
JM38510/34105BSA
M38510/34105B2A
M38510/34105B2A
M38510/34105BRA
M38510/34105BRA
M38510/34105BSA
M38510/34105BSA
SN54F374J
SN54F374J
SNJ54F374FK
SNJ54F374FK
SNJ54F374J
SNJ54F374J
SNJ54F374W
SNJ54F374W
3-State OutputYesYesYesYesYesYesYesYesYesYesYesYesYes
Bits8888888888888
F @ Nom Voltage(Max), Mhz70707070707070707070707070
ICC @ Nom Voltage(Max), mA86868686868686868686868686
Input TypeTTLTTLTTLTTLTTLTTLTTLTTLTTLTTLTTLTTLTTL
Operating Temperature Range, C-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125-55 to 125
Output Drive (IOL/IOH)(Max), mA24/-324/-324/-324/-324/-324/-324/-324/-324/-324/-324/-324/-324/-3
Output TypeTTLTTLTTLTTLTTLTTLTTLTTLTTLTTLTTLTTLTTL
Package GroupLCCCCDIPCFPLCCCCDIPCFPLCCCCDIPCFPCDIPLCCCCDIPCFP
Package Size: mm2:W x L, PKG20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)See datasheet (CDIP)20LCCC: 79 mm2: 8.89 x 8.89(LCCC)See datasheet (CDIP)See datasheet (CFP)
RatingMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitaryMilitary
Technology FamilyFFFFFFFFFFFFF
VCC(Max), V5.55.55.55.55.55.55.55.55.55.55.55.55.5
VCC(Min), V4.54.54.54.54.54.54.54.54.54.54.54.54.5
tpd @ Nom Voltage(Max), ns10101010101010101010101010

Eco Plan

5962-9759001Q2A5962-9759001QRA5962-9759001QSAJM38510/34105B2AJM38510/34105BRAJM38510/34105BSAM38510/34105B2AM38510/34105BRAM38510/34105BSASN54F374JSNJ54F374FKSNJ54F374JSNJ54F374W
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Application Notes

  • Power-Up Behavior of Clocked Devices (Rev. A)
    PDF, 34 Kb, Revision: A, File published: Feb 6, 2015
  • Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A)
    PDF, 105 Kb, Revision: A, File published: Aug 1, 1997
    The spectrum of bus-interface devices with damping resistors or balanced/light output drive currently offered by various logic vendors is confusing at best. Inconsistencies in naming conventions and methods used for implementation make it difficult to identify the best solution for a given application. This report attempts to clarify the issue by looking at several vendors? approaches and discussi
  • Input and Output Characteristics of Digital Integrated Circuits
    PDF, 1.7 Mb, File published: Oct 1, 1996
    This report contains a comprehensive collection of the input and output characteristic curves of typical integrated circuits from various logic families. These curves go beyond the information given in data sheets by providing additional details regarding the characteristics of the components. This knowledge is particularly useful when for example a decision must be made as to which circuit shou
  • TI IBIS File Creation Validation and Distribution Processes
    PDF, 380 Kb, File published: Aug 29, 2002
    The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
  • Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
    PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
  • Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
    PDF, 337 Kb, File published: Jul 8, 2004
    Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
  • Designing With Logic (Rev. C)
    PDF, 186 Kb, Revision: C, File published: Jun 1, 1997
    Data sheets which usually give information on device behavior only under recommended operating conditions may only partially answer engineering questions that arise during the development of systems using logic devices. However information is frequently needed regarding the behavior of the device outside the conditions in the data sheet. Such questions might be:?How does a bus driver behave w
  • Introduction to Logic
    PDF, 93 Kb, File published: Apr 30, 2015

Model Line

Manufacturer's Classification

  • Semiconductors> Space & High Reliability> Logic Products> Flip-Flop/Latch/Registers