Datasheet Texas Instruments 5962-9689001QXA

Manufacturer	Texas Instruments
Series	SN54GTL16612
Part Number	5962-9689001QXA

18-Bit GTL/LVT Universal Bus Transceivers 56-CFP -55 to 125

Datasheets

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PDF, 1.0 Mb, Revision: K, File published: Aug 6, 2001

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Status

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

Packaging

Pin	56	56	56	56
Package Type	WD	WD	WD	WD
Industry STD Term	CFP	CFP	CFP	CFP
JEDEC Code	R-GDFP-F	R-GDFP-F	R-GDFP-F	R-GDFP-F
Package QTY	1	1	1	1
Carrier	TUBE	TUBE	TUBE	TUBE
Device Marking	5962-9689001QX	D	SNJ54GTL16612W	A
Width (mm)	9.66	9.66	9.66	9.66
Length (mm)	18.42	18.42	18.42	18.42
Thickness (mm)	2.48	2.48	2.48	2.48
Pitch (mm)	.635	.635	.635	.635
Max Height (mm)	3.05	3.05	3.05	3.05
Mechanical Data	Download	Download	Download	Download

Parametrics

Bits	18
F @ Nom Voltage(Max)	95 Mhz
ICC @ Nom Voltage(Max)	120 mA
Input Type	GTL/GTL+/LVTTL
Operating Temperature Range	-55 to 125 C
Output Drive (IOL/IOH)(Max)	64 mA
Output Type	GTL/GTL+/LVTTL
Package Group	CFP
Package Size: mm2:W x L	See datasheet (CFP) PKG
Rating	Military
Schmitt Trigger	No
Technology Family	GTL
VCC(Max)	5.25 V
VCC(Min)	3.15 V
tpd @ Nom Voltage(Max)	6.3 ns

Eco Plan

RoHS	See ti.com

Application Notes

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Understanding Advanced Bus-Interface Products Design Guide
PDF, 253 Kb, File published: May 1, 1996
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GTL/BTL: A Low-Swing Solution for High-Speed Digital Logic (Rev. A)
PDF, 184 Kb, Revision: A, File published: Mar 1, 1997
GTL and BTL transceivers provide high-performance, excellent signal integrity and cost-effectiveness in high-speed backplane and point-to-point applications. This document discusses the GTL and BTL devices input/output (I/O) structure, power consumption, simultaneous switching, slew rate, and signal integrity. Design considerations for using these devices are provided.
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TI IBIS File Creation Validation and Distribution Processes
PDF, 380 Kb, File published: Aug 29, 2002
The Input/Output Buffer Information Specification (IBIS) also known as ANSI/EIA-656 has become widely accepted among electronic design automation (EDA) vendors semiconductor vendors and system designers as the format for digital electrical interface data. Because IBIS models do not reveal proprietary internal processes or architectural information semiconductor vendors? support for IBIS con
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Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
PDF, 209 Kb, File published: May 10, 2002
Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
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Understanding and Interpreting Standard-Logic Data Sheets (Rev. C)
PDF, 614 Kb, Revision: C, File published: Dec 2, 2015
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Semiconductor Packing Material Electrostatic Discharge (ESD) Protection
PDF, 337 Kb, File published: Jul 8, 2004
Forty-eight-pin TSSOP components that were packaged using Texas Instruments (TI) standard packing methodology were subjected to electrical discharges between 0.5 and 20 kV as generated by an IEC ESD simulator to determine the level of ISD protection provided by the packing materials. The testing included trays tape and reel and magazines. Additional units were subjected to the same discharge
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Introduction to Logic
PDF, 93 Kb, File published: Apr 30, 2015
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Implications of Slow or Floating CMOS Inputs (Rev. D)
PDF, 260 Kb, Revision: D, File published: Jun 23, 2016

Model Line

Series: SN54GTL16612 (2)

5962-9689001QXA SNJ54GTL16612WD

Manufacturer's Classification

Semiconductors > Space & High Reliability > Logic Products > Backplane Logic (GTL/TTL/BTL/ECL Transceivers/Translators)

Other Names:

59629689001QXA, 5962 9689001QXA