Datasheet Texas Instruments SN74ABT273

Manufacturer	Texas Instruments
Series	SN74ABT273

Datasheets

Prices

Status

Packaging

Parametrics

Parameters / Models	SN74ABT273DBLE	SN74ABT273DBR	SN74ABT273DBRG4	SN74ABT273DW	SN74ABT273DWR	SN74ABT273DWRE4	SN74ABT273DWRG4	SN74ABT273N	SN74ABT273NE4	SN74ABT273NSR	SN74ABT273PW	SN74ABT273PWLE	SN74ABT273PWR	SN74ABT273PWRG4
3-State Output	No	No	No	No	No	No	No	No	No	No	No	No	No	No
Approx. Price (US$)	0.24 | 1ku											0.24 | 1ku
Bits		8	8	8	8	8	8	8	8	8	8		8	8
Bits(#)	8											8
F @ Nom Voltage(Max), Mhz		150	150	150	150	150	150	150	150	150	150		150	150
F @ Nom Voltage(Max)(Mhz)	150											150
ICC @ Nom Voltage(Max), mA		30	30	30	30	30	30	30	30	30	30		30	30
ICC @ Nom Voltage(Max)(mA)	30											30
Input Type	TTL											TTL
Operating Temperature Range, C		-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85		-40 to 85	-40 to 85
Operating Temperature Range(C)	-40 to 85											-40 to 85
Output Drive (IOL/IOH)(Max), mA		64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32	64/-32		64/-32	64/-32
Output Drive (IOL/IOH)(Max)(mA)	64/-32											64/-32
Output Type	TTL											TTL
Package Group	SSOP	SSOP	SSOP	SOIC	SOIC	SOIC	SOIC	PDIP	PDIP	SO	TSSOP	TSSOP	TSSOP	TSSOP
Package Size: mm2:W x L, PKG		20SSOP: 56 mm2: 7.8 x 7.2(SSOP)	20SSOP: 56 mm2: 7.8 x 7.2(SSOP)	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	20SOIC: 132 mm2: 10.3 x 12.8(SOIC)	See datasheet (PDIP)	See datasheet (PDIP)	20SO: 98 mm2: 7.8 x 12.6(SO)	20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)		20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)	20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)
Package Size: mm2:W x L (PKG)	See datasheet (PDIP)											See datasheet (PDIP)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog	Catalog
Schmitt Trigger	No	No	No	No	No	No	No	No	No	No	No	No	No	No
Technology Family	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT	ABT
VCC(Max), V		5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5	5.5		5.5	5.5
VCC(Max)(V)	5.5											5.5
VCC(Min), V		4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5	4.5		4.5	4.5
VCC(Min)(V)	4.5											4.5
Voltage(Nom), V		5	5	5	5	5	5	5	5	5	5		5	5
Voltage(Nom)(V)	5											5
tpd @ Nom Voltage(Max), ns		7.3	7.3	7.3	7.3	7.3	7.3	7.3	7.3	7.3	7.3		7.3	7.3
tpd @ Nom Voltage(Max)(ns)	7.3											7.3

Eco Plan

Application Notes

• Download
  Quad Flatpack No-Lead Logic Packages (Rev. D)
  PDF, 1.0 Mb, Revision: D, File published: Feb 16, 2004
  Texas Instruments (TI) Quad Flatpack No-lead (QFN) 14/16/20-terminal Pb-free plastic packages meet dimensions specified in JEDEC standard MO-241 allow for board miniaturization and hold several advantages over traditional SOIC SSOP TSSOP and TVSOP packages. The packages are physically smaller have a smaller routing area improved thermal performance and improved electrical parasitics while
• Download
  Advanced BiCMOS Technology (ABT) Logic Characterization Information (Rev. B)
  PDF, 528 Kb, Revision: B, File published: Jun 1, 1997
  The purpose of this document is to assist the designers of high-performance digital logic systems in using the advanced BiCMOS technology (ABT) logic family. Detailed electrical characteristics of these bus-interface devices are provided and tables and graphs have been included to compare specific parameters of the ABT family with those of other logic families. In addition typical data is provide
• Download
  Advanced BiCMOS Technology (ABT) Logic Enables Optimal System Design (Rev. A)
  PDF, 115 Kb, Revision: A, File published: Mar 1, 1997
  Advanced bus-interface logic (ABIL) products processed in submicron advanced BiCMOS technologies (ABT) address the specific end-equipment demands of workstations personal and portable computers and telecommunications markets. This document discusses ABIL as system bus interfaces the merits of ABT its I/O structure packaging and ABT products for end-equipment specific solutions.
• Download
  Family of Curves Demonstrating Output Skews for Advanced BiCMOS Devices (Rev. A)
  PDF, 80 Kb, Revision: A, File published: Dec 1, 1996
  This document shows the output skew for the ABT16254 ABT16952 and ABT16500A devices of the TI advanced BiCMOS (ABT) family. The data samples show which output skew is being examined where the data originates and how it is analyzed. Some errors present in the data are discussed. Skew curves at varying temperatures are given for the ABT16240 ABT16245 ABT16952 ABT16500A and ABT16249 devic
• Download
  Understanding Advanced Bus-Interface Products Design Guide
  PDF, 253 Kb, File published: May 1, 1996
• Download
  Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
  PDF, 209 Kb, File published: May 10, 2002
  Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Model Line

Manufacturer's Classification

• Semiconductors> Logic> Flip-Flop/Latch/Register> D-Type Flip-Flop