Datasheet Texas Instruments SN74ALVCH162268GR

Manufacturer	Texas Instruments
Series	SN74ALVCH162268
Part Number	SN74ALVCH162268GR

12-Bit To 24-Bit Registered Bus Exchanger With 3-State Outputs 56-TSSOP -40 to 85

Datasheets

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PDF, 800 Kb, Revision: L, File published: Sep 22, 2004

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Status

Lifecycle Status	Active (Recommended for new designs)
Manufacture's Sample Availability	No

Packaging

Pin	56
Package Type	DGG
Industry STD Term	TSSOP
JEDEC Code	R-PDSO-G
Package QTY	2000
Carrier	LARGE T&R
Device Marking	ALVCH162268
Width (mm)	6.1
Length (mm)	14
Thickness (mm)	1.15
Pitch (mm)	.5
Max Height (mm)	1.2
Mechanical Data	Download

Parametrics

Bits	24
F @ Nom Voltage(Max)	150 Mhz
ICC @ Nom Voltage(Max)	0.04 mA
Operating Temperature Range	-40 to 85 C
Output Drive	-24/24 mA
Package Group	TSSOP
Package Size: mm2:W x L	56TSSOP: 113 mm2: 8.1 x 14(TSSOP) PKG
Rating	Catalog
Schmitt Trigger	No
Technology Family	ALVC
VCC(Max)	3.6 V
VCC(Min)	1.65 V
Voltage(Nom)	1.8,2.5,2.7,3.3 V
tpd @ Nom Voltage(Max)	8,6.1,5.9,5.4 ns

Eco Plan

RoHS

Compliant

Application Notes

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TI SN74ALVC16835 Component Specification Analysis for PC100
PDF, 43 Kb, File published: Aug 3, 1998
The PC100 standard establishes design parameters for the PC SDRAM DIMM that is designed to operate at 100 MHz. The 168-pin, 8-byte, registered SDRAM DIMM is a JEDEC-defined device (JC-42.5-96-146A). Some of the defined signal paths include data signals, address signals, and control signals. This application report discusses the SN74ALVC16835 18-bit universal bus driver that is available from T
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Logic Solutions for PC-100 SDRAM Registered DIMMs (Rev. A)
PDF, 96 Kb, Revision: A, File published: May 13, 1998
Design of high-performance personal computer (PC) systems that are capable of meeting the needs imposed by modern operating systems and software includes the use of large banks of SDRAMs on DIMMs (see Figure 1).To meet the demands of stable functionality over the broad spectrum of operating environments, meet system timing needs, and to support data integrity, the loads presented by the large
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Bus-Hold Circuit
PDF, 418 Kb, File published: Feb 5, 2001
When designing systems that include CMOS devices, designers must pay special attention to the operating condition in which all of the bus drivers are in an inactive, high-impedance condition (3-state). Unless special measures are taken, this condition can lead to undefined levels and, thus, to a significant increase in the device?s power dissipation. In extreme cases, this leads to oscillation of
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16-Bit Widebus Logic Families in 56-Ball 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B)
PDF, 895 Kb, Revision: B, File published: May 22, 2002
TI?s 56-ball MicroStar Jr.E package registered under JEDEC MO-225 has demonstrated through modeling and experimentation that it is an optimal solution for reducing inductance and capacitance improving thermal performance and minimizing board area usage in integrated bus functions. Multiple functions released in the 56-ball MicroStar Jr.E package have superior performance characteristics compa
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Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A)
PDF, 154 Kb, Revision: A, File published: Sep 8, 1999
In the last few years the trend toward reducing supply voltage (VCC) has continued as reflected in an additional specification of 2.5-V VCC for the AVC ALVT ALVC LVC LV and the CBTLV families.In this application report the different logic levels at VCC of 5 V 3.3 V 2.5 V and 1.8 V are compared. Within the report the possibilities for migration from 5-V logic and 3.3-V logic families
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Understanding Advanced Bus-Interface Products Design Guide
PDF, 253 Kb, File published: May 1, 1996

Model Line

Series: SN74ALVCH162268 (2)

SN74ALVCH162268DL SN74ALVCH162268GR

Manufacturer's Classification

Semiconductors > Logic > Universal Bus Function > Universal Bus Exchanger (UBE)