Datasheet Texas Instruments SN74CBT3305C

Manufacturer	Texas Instruments
Series	SN74CBT3305C

Dual FET Bus Switch with -2 V Undershoot-Protection

Datasheets

PDF, 1.0 Mb, Revision: B, File published: Aug 9, 2005

Extract from the document

	SN74CBT3305CD	SN74CBT3305CDR	SN74CBT3305CPW	SN74CBT3305CPWR	SN74CBT3305CPWRG4
Lifecycle Status	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)	Active (Recommended for new designs)
Manufacture's Sample Availability	No	No	No	No	No

	SN74CBT3305CD	SN74CBT3305CDR	SN74CBT3305CPW	SN74CBT3305CPWR	SN74CBT3305CPWRG4
N	1	2	3	4	5
Pin	8	8	8	8	8
Package Type	D	D	PW	PW	PW
Industry STD Term	SOIC	SOIC	TSSOP	TSSOP	TSSOP
JEDEC Code	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G	R-PDSO-G
Package QTY	75	2500	150	2000	2000
Carrier	TUBE	LARGE T&R	TUBE	LARGE T&R	LARGE T&R
Device Marking	CU305C	CU305C	CU305C	CU305C	CU305C
Width (mm)	3.91	3.91	4.4	4.4	4.4
Length (mm)	4.9	4.9	3	3	3
Thickness (mm)	1.58	1.58	1	1	1
Pitch (mm)	1.27	1.27	.65	.65	.65
Max Height (mm)	1.75	1.75	1.2	1.2	1.2
Mechanical Data	Download	Download	Download	Download	Download

Parameters / Models	SN74CBT3305CD	SN74CBT3305CDR	SN74CBT3305CPW	SN74CBT3305CPWR	SN74CBT3305CPWRG4
Additional Features	Powered off protection,-2V undershoot protection	Powered off protection,-2V undershoot protection	Powered off protection,-2V undershoot protection	Powered off protection,-2V undershoot protection	Powered off protection,-2V undershoot protection
Bandwidth, MHz	200	200	200	200	200
Configuration	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST	1:1 SPST
ESD Charged Device Model, kV	1	1	1	1	1
ESD HBM, kV	2	2	2	2	2
Input/Ouput Voltage(Max), V	5.5	5.5	5.5	5.5	5.5
Input/Output Continuous Current(Max), mA	128	128	128	128	128
Input/Output OFF-state Capacitance(Typ), pF	5	5	5	5	5
Input/Output ON-state Capacitance(Typ), pF	12.5	12.5	12.5	12.5	12.5
Number of Channels	2	2	2	2	2
OFF-state leakage current(Max), µA	10	10	10	10	10
Operating Temperature Range, C	-40 to 85	-40 to 85	-40 to 85	-40 to 85	-40 to 85
Package Group	SOIC	SOIC	TSSOP	TSSOP	TSSOP
Package Size: mm2:W x L, PKG	8SOIC: 29 mm2: 6 x 4.9(SOIC)	8SOIC: 29 mm2: 6 x 4.9(SOIC)	8TSSOP: 19 mm2: 6.4 x 3(TSSOP)	8TSSOP: 19 mm2: 6.4 x 3(TSSOP)	8TSSOP: 19 mm2: 6.4 x 3(TSSOP)
Rating	Catalog	Catalog	Catalog	Catalog	Catalog
Ron(Max), Ohms	12	12	12	12	12
Ron(Typ), Ohms	3	3	3	3	3
Supply Current(Max), uA	3	3	3	3	3
Supply Range, Max	5.5	5.5	5.5	5.5	5.5
VIH(Min), V	2	2	2	2	2
VIL(Max), V	0.8	0.8	0.8	0.8	0.8
Vdd(Max), V	5.5	5.5	5.5	5.5	5.5
Vdd(Min), V	4	4	4	4	4
Vss(Max), V	N/A	N/A	N/A	N/A	N/A
Vss(Min), V	N/A	N/A	N/A	N/A	N/A

	SN74CBT3305CD	SN74CBT3305CDR	SN74CBT3305CPW	SN74CBT3305CPWR	SN74CBT3305CPWRG4
RoHS	Compliant	Compliant	Compliant	Compliant	Compliant

Download
CBT-C, CB3T, and CB3Q Signal-Switch Families
PDF, 584 Kb, File published: Feb 4, 2003
Signal switch devices are widely used in applications requiring bus isolation, multiplexing, demultiplexing, and voltage translation. Compared to other logic and linear product alternatives, signal switches are the fastest and least power consuming. Texas Instruments (TI) CBT-C, CB3Q, and CB3T signal-switch families have low on-state resistance, negligible power consumption, and better undershoot
Download
VOLTAGE LEVEL TRANSLATION (SL) - Family
PDF, 111 Kb, File published: Sep 21, 2011
Download
Bus FET Switch Solutions for Live Insertion Applications
PDF, 300 Kb, File published: Feb 7, 2003
In today?s competitive computing and networking industry, any equipment downtime due to component interconnects or bus failures impedes communication, hinders productivity and hampers financial growth. In recognizing this increasingly costly unplanned downtime, the industry introduced live-insertion technology to minimize the impact of any such failures. The live-insertion feature enables a networ

Series: SN74CBT3305C (5)