Datasheet Texas Instruments SN74FB2031RCRG3

ManufacturerTexas Instruments
SeriesSN74FB2031
Part NumberSN74FB2031RCRG3
Datasheet Texas Instruments SN74FB2031RCRG3

9-Bit TTL/BTL Address/Data Transceiver 52-QFP 0 to 70

Datasheets

9-Bit TTL/BTL Address/Data Transceiver datasheet
PDF, 695 Kb, Revision: N, File published: Jun 22, 2001
Extract from the document

Prices

Status

Lifecycle StatusActive (Recommended for new designs)
Manufacture's Sample AvailabilityNo

Packaging

Pin52
Package TypeRC
Industry STD TermQFP
JEDEC CodeS-PQFP-G
Package QTY500
CarrierLARGE T&R
Device MarkingFB2031
Width (mm)10
Length (mm)10
Thickness (mm)2
Pitch (mm).65
Max Height (mm)2.45
Mechanical DataDownload

Parametrics

Bits9
F @ Nom Voltage(Max)150 Mhz
ICC @ Nom Voltage(Max)78 mA
Operating Temperature Range0 to 70 C
Output Drive (IOL/IOH)(Max)100/-32 mA
Package GroupQFP
Package Size: mm2:W x L52QFP: 174 mm2: 13.2 x 13.2(QFP) PKG
RatingCatalog
Schmitt TriggerNo
Technology FamilyFB
VCC(Max)5.5 V
VCC(Min)4.5 V
Voltage(Nom)5 V
tpd @ Nom Voltage(Max)7.8 ns

Eco Plan

RoHSCompliant

Application Notes

  • Next-Generation BTL/Futurebus Transceivers Allow Single-Sided SMT Manufacturing (Rev. C)
    PDF, 65 Kb, Revision: C, File published: Mar 1, 1997
    BTL- and Futurebus-compatible transceivers and switching level meet the requirements of today?s high-speed data-communications and provide significant performance advantages over conventional backplane implementations. This document discusses the current and next generation of BTL/Futurebus Transceivers and the design trade-offs required when using these devices.
  • GTL/BTL: A Low-Swing Solution for High-Speed Digital Logic (Rev. A)
    PDF, 184 Kb, Revision: A, File published: Mar 1, 1997
    GTL and BTL transceivers provide high-performance, excellent signal integrity and cost-effectiveness in high-speed backplane and point-to-point applications. This document discusses the GTL and BTL devices input/output (I/O) structure, power consumption, simultaneous switching, slew rate, and signal integrity. Design considerations for using these devices are provided.
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, File published: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Model Line

Series: SN74FB2031 (2)

Manufacturer's Classification

  • Semiconductors > Logic > Backplane Logic (GTL/TTL/BTL/ECL Transceiver/Translator)