Datasheet Texas Instruments SN74GTLP1395

ManufacturerTexas Instruments
SeriesSN74GTLP1395
Datasheet Texas Instruments SN74GTLP1395

Two 1-Bit LVTTL/GTLP Adj-Edge-Rate Bus Xcvrs w Split LVTTL Port, Fdbk Path and Selectable Polarity

Datasheets

Two 1-Bit LVTTL-to-GTLP Adj-Edge-Rate Bus Xcvrs w/ Split LVTTL Port, FB Path, & datasheet
PDF, 1.2 Mb, Revision: C, File published: Jan 3, 2006
Extract from the document

Prices

Status

SN74GTLP1395DWRSN74GTLP1395PWSN74GTLP1395PWR
Lifecycle StatusActive (Recommended for new designs)Active (Recommended for new designs)Active (Recommended for new designs)
Manufacture's Sample AvailabilityNoYesYes

Packaging

SN74GTLP1395DWRSN74GTLP1395PWSN74GTLP1395PWR
N123
Pin202020
Package TypeDWPWPW
Industry STD TermSOICTSSOPTSSOP
JEDEC CodeR-PDSO-GR-PDSO-GR-PDSO-G
Package QTY2000702000
CarrierLARGE T&RTUBELARGE T&R
Device MarkingGTLP1395GP395GP395
Width (mm)7.54.44.4
Length (mm)12.86.56.5
Thickness (mm)2.3511
Pitch (mm)1.27.65.65
Max Height (mm)2.651.21.2
Mechanical DataDownloadDownloadDownload

Parametrics

Parameters / ModelsSN74GTLP1395DWR
SN74GTLP1395DWR
SN74GTLP1395PW
SN74GTLP1395PW
SN74GTLP1395PWR
SN74GTLP1395PWR
Bits222
F @ Nom Voltage(Max), Mhz175175175
ICC @ Nom Voltage(Max), mA202020
Operating Temperature Range, C-40 to 85-40 to 85-40 to 85
Output Drive (IOL/IOH)(Max), mA100100100
Package GroupSOICTSSOPTSSOP
Package Size: mm2:W x L, PKG20SOIC: 132 mm2: 10.3 x 12.8(SOIC)20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)20TSSOP: 42 mm2: 6.4 x 6.5(TSSOP)
RatingCatalogCatalogCatalog
Schmitt TriggerNoNoNo
Technology FamilyGTLPGTLPGTLP
VCC(Max), V3.453.453.45
VCC(Min), V3.153.153.15
Voltage(Nom), V3.33.33.3
tpd @ Nom Voltage(Max), ns9.79.79.7

Eco Plan

SN74GTLP1395DWRSN74GTLP1395PWSN74GTLP1395PWR
RoHSCompliantCompliantCompliant

Application Notes

  • Texas Instruments GTLP Frequently Asked Questions
    PDF, 496 Kb, File published: Jan 1, 2001
    Using a question-and-answer format, advantages of TI?s GTLP devices, particularly for backplane applications, are presented, as well as differences between GTLP and GTL/LVDS devices. Applicable topics include data throughput rates, synchronous clocks, price and alternative sources, bus transceivers, live insertion, power consumption, backplane termination, voltage translation, IBIS and HSPICE mode
  • Logic in Live-Insertion Applications With a Focus on GTLP
    PDF, 493 Kb, File published: Jan 14, 2002
    Live-insertion capability is an essential part of today?s high-speed data systems because those systems are expected to run continuously without being powered down. This application report delves into the cause and prevention of live-insertion and nanosecond-discontinuity effects, using both simulation and actual test measurements from a specially built GTLP EVM. Hypothetical cases for precharge c
  • Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP)
    PDF, 585 Kb, File published: Apr 5, 2001
    This application report compares two approaches for synchronous bus-system designs. The focus of the report is the comparison of a system using central-synchronous system clock (CSSC) with a system operated with a source-synchronous system clock (SSSC).The basic characteristics of lines, key factors that influence the bus line delay, and the impedance of bus lines are described.The theoretical
  • Fast GTLP Backplanes With the GTLPH1655 (Rev. A)
    PDF, 1.1 Mb, Revision: A, File published: Sep 19, 2000
    This revision of the Fast GTL Backplanes With the GTL1655 application report addresses improvements, such as the improved OECE circuitry and implementation of theTexas Instruments TI-OPCE circuitry, that have been incorporated in the GTLPH1655 device. These improvements significantly improve signal integrity in distributed loads.This application report describes the physical principles of fast
  • Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices
    PDF, 209 Kb, File published: May 10, 2002
    Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features

Model Line

Manufacturer's Classification

  • Semiconductors> Logic> Backplane Logic (GTL/TTL/BTL/ECL Transceiver/Translator)