Datasheet Texas Instruments 74GTLPH306DGVRE4
| Manufacturer | Texas Instruments |
| Series | SN74GTLPH306 |
| Part Number | 74GTLPH306DGVRE4 |
8-Bit LVTTL-to-GTLP Bus Transceiver 24-TVSOP -40 to 85
Datasheets
8-Bit LVTTL-to-GTL+ Bus Transceiver datasheet
PDF, 583 Kb, Revision: E, File published: Aug 14, 2001
Extract from the document
Prices
Status
| Lifecycle Status | Active (Recommended for new designs) |
| Manufacture's Sample Availability | Yes |
Packaging
| Pin | 24 |
| Package Type | DGV |
| Industry STD Term | TVSOP |
| JEDEC Code | R-PDSO-G |
| Package QTY | 2000 |
| Carrier | LARGE T&R |
| Device Marking | GH306 |
| Width (mm) | 4.4 |
| Length (mm) | 5 |
| Thickness (mm) | 1.05 |
| Pitch (mm) | .4 |
| Max Height (mm) | 1.2 |
| Mechanical Data | Download |
Parametrics
| Bits | 8 |
| F @ Nom Voltage(Max) | 175 Mhz |
| ICC @ Nom Voltage(Max) | 20 mA |
| Operating Temperature Range | -40 to 85 C |
| Output Drive (IOL/IOH)(Max) | 50 mA |
| Package Group | TVSOP |
| Package Size: mm2:W x L | 24TVSOP: 32 mm2: 6.4 x 5(TVSOP) PKG |
| Rating | Catalog |
| Schmitt Trigger | No |
| Technology Family | GTLP |
| VCC(Max) | 3.45 V |
| VCC(Min) | 3.15 V |
| Voltage(Nom) | 3.3 V |
| tpd @ Nom Voltage(Max) | 7.5 ns |
Eco Plan
| RoHS | Compliant |
Application Notes
- Texas Instruments GTLP Frequently Asked QuestionsPDF, 496 Kb, File published: Jan 1, 2001
Using a question-and-answer format, advantages of TI?s GTLP devices, particularly for backplane applications, are presented, as well as differences between GTLP and GTL/LVDS devices. Applicable topics include data throughput rates, synchronous clocks, price and alternative sources, bus transceivers, live insertion, power consumption, backplane termination, voltage translation, IBIS and HSPICE mode - Logic in Live-Insertion Applications With a Focus on GTLPPDF, 493 Kb, File published: Jan 14, 2002
Live-insertion capability is an essential part of today?s high-speed data systems because those systems are expected to run continuously without being powered down. This application report delves into the cause and prevention of live-insertion and nanosecond-discontinuity effects, using both simulation and actual test measurements from a specially built GTLP EVM. Hypothetical cases for precharge c - Achieving Maximum Speed on Parallel Buses With Gunning Transceiver Logic (GTLP)PDF, 585 Kb, File published: Apr 5, 2001
This application report compares two approaches for synchronous bus-system designs. The focus of the report is the comparison of a system using central-synchronous system clock (CSSC) with a system operated with a source-synchronous system clock (SSSC).The basic characteristics of lines, key factors that influence the bus line delay, and the impedance of bus lines are described.The theoretical - Fast GTLP Backplanes With the GTLPH1655 (Rev. A)PDF, 1.1 Mb, Revision: A, File published: Sep 19, 2000
This revision of the Fast GTL Backplanes With the GTL1655 application report addresses improvements, such as the improved OECE circuitry and implementation of theTexas Instruments TI-OPCE circuitry, that have been incorporated in the GTLPH1655 device. These improvements significantly improve signal integrity in distributed loads.This application report describes the physical principles of fast - Power-Up 3-State (PU3S) Circuits in TI Standard Logic DevicesPDF, 209 Kb, File published: May 10, 2002
Many telecom and networking applications require that cards be inserted and extracted from a live backplane without interrupting data or damaging components. To achieve this interface terminals of the card must be electrically isolated from the bus system during insertion or extraction from the backplane. To facilitate this Texas Instruments provides bus-interface and logic devices with features
Model Line
Series: SN74GTLPH306 (6)
- 74GTLPH306DGVRE4 SN74GTLPH306DGVR SN74GTLPH306DW SN74GTLPH306DWR SN74GTLPH306PW SN74GTLPH306PWR
Manufacturer's Classification
- Semiconductors > Logic > Backplane Logic (GTL/TTL/BTL/ECL Transceiver/Translator)
