Datasheet Texas Instruments TMP006
| Manufacturer | Texas Instruments |
| Series | TMP006 |
Infrared Thermopile Contactless Temperature Sensor in WCSP Package
Datasheets
TMP006/B Infrared Thermopile Sensor in Chip-Scale Package datasheet
PDF, 725 Kb, Revision: E, File published: Apr 9, 2015
Prices
Status
| HPA01108AIYZFR | TMP006AIYZFR | TMP006AIYZFT | TMP006BIYZFR | TMP006BIYZFT | |
|---|---|---|---|---|---|
| Lifecycle Status | NRND (Not recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) | Active (Recommended for new designs) |
| Manufacture's Sample Availability | No | Yes | No | Yes | No |
Packaging
| HPA01108AIYZFR | TMP006AIYZFR | TMP006AIYZFT | TMP006BIYZFR | TMP006BIYZFT | |
|---|---|---|---|---|---|
| N | 1 | 2 | 3 | 4 | 5 |
| Pin | 8 | 8 | 8 | 8 | 8 |
| Package Type | YZF | YZF | YZF | YZF | YZF |
| Industry STD Term | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA |
| JEDEC Code | S-XBGA-N | S-XBGA-N | S-XBGA-N | S-XBGA-N | S-XBGA-N |
| Package QTY | 3000 | 3000 | 250 | 3000 | 250 |
| Carrier | LARGE T&R | LARGE T&R | SMALL T&R | LARGE T&R | SMALL T&R |
| Device Marking | TMP006 | TMP006 | TMP006 | T006B | T006B |
| Width (mm) | 1.75 | 1.75 | 1.75 | 1.75 | 1.75 |
| Length (mm) | 1.75 | 1.75 | 1.75 | 1.75 | 1.75 |
| Pitch (mm) | .5 | .5 | .5 | .5 | .5 |
| Max Height (mm) | .625 | .625 | .625 | .625 | .625 |
| Mechanical Data | Download | Download | Download | Download | Download |
Parametrics
| Parameters / Models | HPA01108AIYZFR | TMP006AIYZFR | TMP006AIYZFT | TMP006BIYZFR | TMP006BIYZFT |
|---|---|---|---|---|---|
| Approx. Price (US$) | 1.50 | 1ku | 1.50 | 1ku | 1.50 | 1ku | 1.50 | 1ku | |
| Infrared Sensor Accuracy(Max)(+/- C) | 3 | 3 | 3 | 3 | |
| Interface | I2C SMBus 2-Wire | I2C SMBus 2-Wire | I2C SMBus 2-Wire | I2C SMBus 2-Wire | |
| Local Sensor Accuracy(Max)(+/- C) | 1 | 1 | 1 | 1 | |
| Operating Temperature Range(C) | -40 to 125 | -40 to 125 | -40 to 125 | -40 to 125 | |
| Package Group | DSBGA | DSBGA | DSBGA | DSBGA | |
| Special Features | Shutdown | Shutdown | Shutdown | Shutdown | |
| Supply Current(Typ)(uA) | 240 | 240 | 240 | 240 | |
| Supply Voltage(Max)(V) | 5.5V | 5.5V | 5.5V | 5.5V | |
| Supply Voltage(Min)(V) | 2.2 | 2.2 | 2.2 | 2.2 | |
| Temp Range for Listed Accuracy(C) | 0 to 60 | 0 to 60 | 0 to 60 | 0 to 60 | |
| Temp Resolution(Max)(bits) | 14 | 14 | 14 | 14 |
Eco Plan
| HPA01108AIYZFR | TMP006AIYZFR | TMP006AIYZFT | TMP006BIYZFR | TMP006BIYZFT | |
|---|---|---|---|---|---|
| RoHS | Compliant | Compliant | Compliant | Compliant | Compliant |
| Pb Free | Yes | Yes | Yes | Yes |
Application Notes
- TMP006 and TMP007: Through-Hole Mounting MethodPDF, 1.8 Mb, File published: Sep 1, 2016
This applicationnotedescribesa new methodof mountingTMP007WCSPdie on the printed-circuitboard(PCB).The advantagesof the new methodare describedand mountingrecommendationsare provided.All of the followingrecommendationsand conclusionsare also true for TMP006parts. - AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AG)PDF, 13.7 Mb, Revision: AG, File published: Aug 12, 2015
- Understanding the I2C BusPDF, 124 Kb, File published: Jun 30, 2015
Model Line
Series: TMP006 (5)
Manufacturer's Classification
- Semiconductors> Sensing Products> Temperature Sensors> IR & Probe Temperature Sensors
