Plastic Packages for Integrated Circuits Package Outline Drawing
Q208.28x28E
208 LEAD PLASTIC QUAD FLATPACK PACKAGE WITH EXPOSED PAD (PQFP-EP)
Rev 1, 6/13
MILLIMETERS D
SYMBOL MIN NOM MAX MIN NOM MAX D2 A -4.10 -0.161 A1 0.25 -0.010 -A2 3.20 3.32 3.60 0.126 0.131 0.142 -D-D 30.60 BSC D1 28.00 BSC 1.102 BSC E 30.60 BSC 1.205 BSC E1
-B-E2 28.00 BSC
-0.25 0.003 -R1 0.08 -0.003 -q 0В° 3.5В° 7В° 0В° 3.5В° 7В° q1 0В° -0В° -8В° REF q3 4X
e b bbb H A-B D ddd M C A-B s D s TOP VIEW
Оё1 1.102 BSC 0.08 q2 4X
aaaC A-B D 1.205 BSC R2 0.010 8В° REF 8В° REF 8В° REF c 0.09 0.15 0.20 0.004 0.006 0.008 L 0.45 0.60 0.75 0.018 0.024 0.030 L1 1.30 REF 0.051 REF S 0.20 -0.008 -b 0.17 0.20 0.27 0.007 0.008 0.011 e 0.50 BSC 0.020 BSC D2 25.50 1.004 E2 25.50 1.004 TOLERANCES OF FORM AND POSITION
Оё -C-SEATING
PLANE
ccc C
-0.05 S A1 SIDE VIEW A A2 c
L1 aaa 0.20 bbb 0.20 0.008
0.008 ccc -0.08 -0.003 -ddd -0.08 -0.003 -NOTES:
1. Dimensions D1 and E1 do not include mold protrusion.
2. Dimension b does not include dambar protrusion. Allowable dambar
protrusion shall not cause the lead width to exceed the maximum b
dimension by more than 0.08mm. Dambar cannot be located on the
lower radius or the foot. Minimum space between protrusion and an
adjacent lead shall not be less than 0.07mm. …
