Plastic Packages for Integrated Circuits Package Outline Drawing
M20.173A
20 LEAD HEATSINK THIN SHRINK SMALL OUTLINE PACKAGE (HTSSOP)
Rev 1, 10/15
A
1 3 6.50 В±0.10 3.000 В±0.1 6.40 PIN #1
I.D. MARK 4.40 В±0.10
2 4.19 В±0.10 SEE DETAIL "X"
10 20 3 EXPOSED
THERMAL PAD 0.20 C B A 1 9
B 0.65 0.09-0.20 TOP VIEW END VIEW BOTTOM VIEW 1.00 REF
H -0.05 C
1.20 MAX SEATING
PLANE 0.90 +0.15/-0.10
GAUGE
PLANE 0.25 +0.05/-0.06 5
0.10 M C B A 0.10 C 0 MIN TO 0.15 MAX
SIDE VIEW 0.60 В±0.15 0.25 0В°-8В° DETAIL "X" (4.19) (1.45) NOTES:
1. Dimension does not include mold flash, protrusions or gate burrs.
Mold flash, protrusions or gate burrs shall not exceed 0.15 per side. (5.65) (3.00) 2. Dimension does not include interlead flash or protrusion. Interlead
flash or protrusion shall not exceed 0.25 per side.
3. Dimensions are measured at datum plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994. …
