Plastic Packages for Integrated Circuits
HTSSOP (Heat-Sink TSSOP) Family
MDP0048 0.25 M C A B
D HTSSOP (HEAT-SINK TSSOP) FAMILY A
(N/2)+1 N MILLIMETERS
SYMBOL 14 LD 20 LD 24 LD 28 LD 38 LD TOLERANCE
PIN #1 I.D. E E1 1 0.20 C B A
2X
N/2 LEAD TIPS (N/2)
TOP VIEW B D1 EXPOSED
THERMAL PAD E2 1.20 1.20 1.20 1.20 Max 0.075 0.075 0.075 0.075 В±0.075 A2 0.90 0.90 0.90 0.90 0.90 +0.15/-0.10 b 0.25 0.25 0.25 0.25 0.22 +0.05/-0.06 c 0.15 0.15 0.15 0.15 0.15 +0.05/-0.06 D 5.00 6.50 7.80 9.70 9.70 В±0.10 D1 3.2 4.2 4.3 5.0 7.25 Reference E 6.40 6.40 6.40 6.40 6.40 Basic E1 4.40 4.40 4.40 4.40 4.40 В±0.10 E2 3.0 3.0 3.0 3.0 3.0 Reference e 0.65 0.65 0.65 0.65 0.50 Basic L 0.60 0.60 0.60 0.60 0.60 В±0.15 L1 1.00 1.00 1.00 1.00 1.00 Reference N 14 20 24 28 38 Reference NOTES: 0.05 e 1.20
0.075 Rev. 3 2/07 BOTTOM VIEW C A
A1 H 1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side. SEATING
PLANE
0.10 C
N LEADS 3. Dimensions “D” and “E1” are measured at Datum Plane H. 0.10 M C A B b 4. Dimensioning and tolerancing per ASME Y14.5M-1994. SIDE VIEW SEE DETAIL “X” c END VIEW L1
A A2 GAUGE
PLANE …
