Package Intersil W3x3.9C

ManufacturerIntersil
SeriesWLCSP
Part NumberW3x3.9C
Package Intersil W3x3.9C

3x3 Array 9 Ball Wafer Level Chip Scale Package

Package Outline Drawing (POD)

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Parametrics

FamilyWLCSP-BP
Pin Count9
Length1.30 mm
Width1.50 mm
Lead Free Peak Temperature260 °C
Package IndexW3X3.9C

Model Line

Manufacturer's Classification

  • Plastic Packages