Package Intersil W4x7.28

ManufacturerIntersil
SeriesWLCSP
Part NumberW4x7.28
Package Intersil W4x7.28

28 BALL WAFER LEVEL CHIP SCALE PACKAGE (WLCSP 0.4mm Pitch)

Package Outline Drawing (POD)

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Parametrics

FamilyWLCSP-BP
Pin Count28
Length2.86 mm
Width1.66 mm
Thickness0.50 mm
Height max0.55 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW4X7.28

Model Line

Manufacturer's Classification

  • Plastic Packages