Package Intersil W5x5.25G

ManufacturerIntersil
SeriesWLCSP
Part NumberW5x5.25G
Package Intersil W5x5.25G

5x5 Array 25 Balls with 0.4mm Pitch Wafer Level Chip Scale Package (WLCSP)

Package Outline Drawing (POD)

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Parametrics

FamilyWLCSP-BP
Pin Count25
Length2.38 mm
Width2.34 mm
Height max0.59 mm
Pitch0.40 mm
Lead Free Peak Temperature260 °C
Package IndexW5X5.25G

Model Line

Manufacturer's Classification

  • Plastic Packages